Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature

Hui Cao, Zhiyuan Rui, Fuqian Yang

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

Nanostructured materials likely exhibit different mechanical properties from the corresponding bulk materials and have potential applications in a variety of areas. In this work, we use molecular dynamics simulation with embedded-atom potential to investigate the dependence of the mechanical properties of Cu nanowires of square cross-section, including Young's modulus, yield stress and surface force, on cross-sectional area and temperature for the Cu nanowires with cross-sectional areas in a range of 13.1 to 117.6 nm2 in a temperature range of 100 to 500 K. The simulation results reveal that the Young's modulus increases with the increase of the cross-sectional area at the same temperature and decreases with the increase of temperature for the same cross-sectional area. The yield stress decreases with the increase of the cross-sectional area at the same temperature in the range of 100 to 400 K and increases with the increase of the cross-sectional area at 500 K, while it decreases with the increase of temperature for the same cross-sectional area. The surface force decreases with the increase of the cross-sectional area at the same temperature and with the increase of temperature for the same cross-sectional area. Semi-empirical expressions relating the mechanical properties to temperature are proposed. Using the semi-empirical expressions, the Young's modulus at 0 K is found to decrease with the decrease of the cross-sectional area, and the yield stress at 0 K is found to decrease linearly with the increase of the cross-sectional area.

Original languageEnglish
Article number139644
JournalMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Volume791
DOIs
StatePublished - Jul 22 2020

Bibliographical note

Funding Information:
ZR is grateful for the support of the National Natural Science Foundation of China (Grant No. 51865027 ), and HC is grateful for the support through the Doctoral Research Foundation and the Abroad Exchange Fund of Outstanding Students of Lanzhou University of Technology.

Publisher Copyright:
© 2020 Elsevier B.V.

Keywords

  • Cross-sectional area
  • Cu nanowires
  • Mechanical properties
  • Molecular dynamics simulation
  • Temperature

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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