Abstract
A micro-indenter consisting of a piezo-electric driven flat cylindrical punch has been used to measure the dynamic mechanical properties of polystyrene films as thin as 50 μm. The measured viscoelastic response was sensitive to the bonding of the polystyrene to an underlying silicon substrate for films which were thinner than one indenter diameter. The instrument therefore was shown to have practical use in measuring the dynamic mechanical response of polymer films, and the strength of bonding between disparate materials.
| Original language | English |
|---|---|
| Pages (from-to) | 852-858 |
| Number of pages | 7 |
| Journal | Journal of Electronic Materials |
| Volume | 26 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1997 |
Bibliographical note
Funding Information:This work has been supported by the Natural Sciences and Engineering Research Council of Canada.
Keywords
- Dynamic mechanical test
- Microindentation
- Polymer films
- Polystyrene
- Viscoelastic
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry