Microstructural studies of Cu brazing on AlN

Chaoxian Cai; Janet K. Lumpp

doi:10.1557/JMR.2001.0125

Microstructural studies of Cu brazing on AlN

Chaoxian Cai, Janet K. Lumpp

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

The microstructures and phase compositions of Cu-Ag-Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.

Original language	English
Pages (from-to)	670-677
Number of pages	8
Journal	Journal of Materials Research
Volume	16
Issue number	3
DOIs	https://doi.org/10.1557/JMR.2001.0125
State	Published - Mar 2001

Bibliographical note

Funding Information:
This work was supported by National Science Foundation Grant ECS-9702108. The authors wish to thank General Ceramics, Inc., and Williams Advanced Materials, Inc., for their donating of materials.

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/JMR.2001.0125

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title = "Microstructural studies of Cu brazing on AlN",

abstract = "The microstructures and phase compositions of Cu-Ag-Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.",

author = "Chaoxian Cai and Lumpp, {Janet K.}",

note = "Funding Information: This work was supported by National Science Foundation Grant ECS-9702108. The authors wish to thank General Ceramics, Inc., and Williams Advanced Materials, Inc., for their donating of materials.",

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AU - Cai, Chaoxian

AU - Lumpp, Janet K.

N1 - Funding Information: This work was supported by National Science Foundation Grant ECS-9702108. The authors wish to thank General Ceramics, Inc., and Williams Advanced Materials, Inc., for their donating of materials.

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N2 - The microstructures and phase compositions of Cu-Ag-Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.

AB - The microstructures and phase compositions of Cu-Ag-Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.

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Microstructural studies of Cu brazing on AlN

Abstract

Bibliographical note

ASJC Scopus subject areas

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