Microstructural studies of Cu brazing on AlN

Chaoxian Cai, Janet K. Lumpp

Research output: Contribution to journalArticlepeer-review

6 Scopus citations


The microstructures and phase compositions of Cu-Ag-Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.

Original languageEnglish
Pages (from-to)670-677
Number of pages8
JournalJournal of Materials Research
Issue number3
StatePublished - Mar 2001

Bibliographical note

Funding Information:
This work was supported by National Science Foundation Grant ECS-9702108. The authors wish to thank General Ceramics, Inc., and Williams Advanced Materials, Inc., for their donating of materials.

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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