Non-hermetic micropackage for chronic implantable systems

P. Wang, S. B. Lachhman, D. Sun, S. J.A. Majerus, M. S. Damaser, C. A. Zorman, P. X.L. Feng, W. H. Ko

Research output: Contribution to conferencePaperpeer-review

12 Scopus citations


We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformai coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ∼2-5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ∼2-5 years) using these non-hermetic coating materials and composites.

Original languageEnglish
Number of pages5
StatePublished - 2013
Event46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013 - Orlando, FL, United States
Duration: Sep 30 2013Oct 3 2013


Conference46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013
Country/TerritoryUnited States
CityOrlando, FL


  • Epoxy
  • Lifetime
  • MEMS
  • Micropackage
  • Non-hermetic package
  • PDMS
  • Parylene
  • Permeability

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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