Non-hermetic micropackage for chronic implantable systems

P. Wang; S. B. Lachhman; D. Sun; S. J.A. Majerus; M. S. Damaser; C. A. Zorman; P. X.L. Feng; W. H. Ko

Non-hermetic micropackage for chronic implantable systems

P. Wang, S. B. Lachhman, D. Sun, S. J.A. Majerus, M. S. Damaser, C. A. Zorman, P. X.L. Feng, W. H. Ko

Research output: Contribution to conference › Paper › peer-review

12 Scopus citations

Abstract

We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformai coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ∼2-5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ∼2-5 years) using these non-hermetic coating materials and composites.

Original language	English
Pages	166-170
Number of pages	5
State	Published - 2013
Event	46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013 - Orlando, FL, United States Duration: Sep 30 2013 → Oct 3 2013

Conference

Conference	46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013
Country/Territory	United States
City	Orlando, FL
Period	9/30/13 → 10/3/13

Keywords

Epoxy
Lifetime
MEMS
Micropackage
Non-hermetic package
PDMS
Parylene
Permeability

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

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title = "Non-hermetic micropackage for chronic implantable systems",

abstract = "We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformai coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ∼2-5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ∼2-5 years) using these non-hermetic coating materials and composites.",

keywords = "Epoxy, Lifetime, MEMS, Micropackage, Non-hermetic package, PDMS, Parylene, Permeability",

author = "P. Wang and Lachhman, {S. B.} and D. Sun and Majerus, {S. J.A.} and Damaser, {M. S.} and Zorman, {C. A.} and Feng, {P. X.L.} and Ko, {W. H.}",

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note = "46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013 ; Conference date: 30-09-2013 Through 03-10-2013",

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T1 - Non-hermetic micropackage for chronic implantable systems

AU - Wang, P.

AU - Lachhman, S. B.

AU - Sun, D.

AU - Majerus, S. J.A.

AU - Damaser, M. S.

AU - Zorman, C. A.

AU - Feng, P. X.L.

AU - Ko, W. H.

PY - 2013

Y1 - 2013

N2 - We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformai coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ∼2-5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ∼2-5 years) using these non-hermetic coating materials and composites.

AB - We report on the development of a non-hermetic micropackage technology that employs multiple layers of polydimethylsiloxane (PDMS), epoxy, and parylene-C thin films for conformai coating of chronic biomedical implantable systems with laboratory testing results in saline bath at 85°C, achieving very long micropackaging lifetime (up to ∼2-5 years). By combining experiments of material characterization and qualitative analysis of the observations, we explain the measured long lifetimes of the micropackages (projected equivalent of ∼2-5 years) using these non-hermetic coating materials and composites.

KW - Epoxy

KW - Lifetime

KW - MEMS

KW - Micropackage

KW - Non-hermetic package

KW - PDMS

KW - Parylene

KW - Permeability

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M3 - Paper

AN - SCOPUS:84897423989

SP - 166

EP - 170

T2 - 46th Annual IMAPS International Symposium on Microelectronics, IMAPS 2013

Y2 - 30 September 2013 through 3 October 2013

ER -

Non-hermetic micropackage for chronic implantable systems

Abstract

Conference

Keywords

ASJC Scopus subject areas

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