Observations of dislocation motion and stress inhomogeneities in a thin copper film

T. John Balk, Gerhard Dehm, Eduard Arzt

Research output: Contribution to journalConference articlepeer-review

11 Scopus citations

Abstract

In situ transmission electron microscopy has been utilized to study dislocation plasticity in a 200 nm thick copper film. The behavior of dislocations in a [111]-oriented grain was recorded during a thermal cycle. During cooling, it was observed that dislocations were emitted from a grain boundary triple junction in regular intervals of 30°C to 40°C. Subsequent glide occurred on a (111) plane parallel to the film surface, despite the expectation of zero resolved shear stress on such planes. The initial emitted dislocations remained close to the triple junction, avoiding contact with another [111] grain rotated by 17°. Glide into the opposite end of the grain was initiated only after the injection of several additional dislocations, which induced strong curvature in all dislocations near the active triple junction. Post mortem examination of dislocation curvature revealed that an inhomogeneous stress state existed within the grain.

Original languageEnglish
Pages (from-to)P2.7.1-P2.7.6
JournalMaterials Research Society Symposium Proceedings
Volume673
DOIs
StatePublished - 2001
EventDislocations and Deformation Mechanics in Thin Films and Small Structures - San Francisco, CA, United States
Duration: Apr 17 2001Apr 19 2001

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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