Passivation effects in copper thin films

G. Wiederhirn; T. J. Balk; G. Dehm; J. Nucci; G. Richter; E. Arzt

doi:10.1063/1.2173548

Passivation effects in copper thin films

G. Wiederhirn, T. J. Balk, G. Dehm, J. Nucci, G. Richter, E. Arzt

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

We studied the influence of a 10 nm Al_xO_y passivation on the stress-temperature behavior of 100 nm and 1 μm thick Cu films. At low temperatures, the passivation induces a large tensile stress increase in the 100 nm film; however, its effect on the 1 μm film is negligible. At high temperatures, the opposite behavior is observed; while the passivation does not change the 100 nm film behavior, it strengthens the 1 μm film by driving it deeper into compression. These observations are explained in light of a combination of constrained diffusional creep and dislocation dynamics unique to ultra-thin films.

Original language	English
Title of host publication	STRESS-INDUCED PHENOMENA IN METALLIZATION
Subtitle of host publication	Eighth International Workshop on Stress-Induced Phenomena in Metallization
Pages	185-191
Number of pages	7
DOIs	https://doi.org/10.1063/1.2173548
State	Published - Feb 7 2006
Event	8th International Workshop on Stress-Induced Phenomena in Metallization - Dresden, Germany Duration: Sep 12 2005 → Sep 14 2005

Publication series

Name	AIP Conference Proceedings
Volume	817
ISSN (Print)	0094-243X
ISSN (Electronic)	1551-7616

Conference

Conference	8th International Workshop on Stress-Induced Phenomena in Metallization
Country/Territory	Germany
City	Dresden
Period	9/12/05 → 9/14/05

Keywords

Passivation
Thermomechanical behavior
Thin films mechanics

ASJC Scopus subject areas

Physics and Astronomy (all)

Access to Document

10.1063/1.2173548

Cite this

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title = "Passivation effects in copper thin films",

abstract = "We studied the influence of a 10 nm AlxOy passivation on the stress-temperature behavior of 100 nm and 1 μm thick Cu films. At low temperatures, the passivation induces a large tensile stress increase in the 100 nm film; however, its effect on the 1 μm film is negligible. At high temperatures, the opposite behavior is observed; while the passivation does not change the 100 nm film behavior, it strengthens the 1 μm film by driving it deeper into compression. These observations are explained in light of a combination of constrained diffusional creep and dislocation dynamics unique to ultra-thin films.",

keywords = "Passivation, Thermomechanical behavior, Thin films mechanics",

author = "G. Wiederhirn and Balk, {T. J.} and G. Dehm and J. Nucci and G. Richter and E. Arzt",

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Wiederhirn, G, Balk, TJ, Dehm, G, Nucci, J, Richter, G & Arzt, E 2006, Passivation effects in copper thin films. in STRESS-INDUCED PHENOMENA IN METALLIZATION: Eighth International Workshop on Stress-Induced Phenomena in Metallization. AIP Conference Proceedings, vol. 817, pp. 185-191, 8th International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 9/12/05. https://doi.org/10.1063/1.2173548

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T1 - Passivation effects in copper thin films

AU - Wiederhirn, G.

AU - Balk, T. J.

AU - Dehm, G.

AU - Nucci, J.

AU - Richter, G.

AU - Arzt, E.

PY - 2006/2/7

Y1 - 2006/2/7

N2 - We studied the influence of a 10 nm AlxOy passivation on the stress-temperature behavior of 100 nm and 1 μm thick Cu films. At low temperatures, the passivation induces a large tensile stress increase in the 100 nm film; however, its effect on the 1 μm film is negligible. At high temperatures, the opposite behavior is observed; while the passivation does not change the 100 nm film behavior, it strengthens the 1 μm film by driving it deeper into compression. These observations are explained in light of a combination of constrained diffusional creep and dislocation dynamics unique to ultra-thin films.

AB - We studied the influence of a 10 nm AlxOy passivation on the stress-temperature behavior of 100 nm and 1 μm thick Cu films. At low temperatures, the passivation induces a large tensile stress increase in the 100 nm film; however, its effect on the 1 μm film is negligible. At high temperatures, the opposite behavior is observed; while the passivation does not change the 100 nm film behavior, it strengthens the 1 μm film by driving it deeper into compression. These observations are explained in light of a combination of constrained diffusional creep and dislocation dynamics unique to ultra-thin films.

KW - Passivation

KW - Thermomechanical behavior

KW - Thin films mechanics

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T3 - AIP Conference Proceedings

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EP - 191

BT - STRESS-INDUCED PHENOMENA IN METALLIZATION

Y2 - 12 September 2005 through 14 September 2005

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Passivation effects in copper thin films

Abstract

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Conference

Keywords

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