Performance analysis of 3-dimensional ridge acquisition from live finger and palm surface scans

Abhishika Fatehpuria, Daniel L. Lau, Veerganesh Yalla, Laurence G. Hassebrook

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations


Fingerprints are one of the most commonly used and relied-upon biometric technology. But often the captured fingerprint image is far from ideal due to imperfect acquisition techniques that can be slow and cumbersome to use without providing complete fingerprint information. Most of the difficulties arise due to the contact of the fingerprint surface with the sensor platen. To overcome these difficulties we have been developing a non-contact scanning system for acquiring a 3-D scan of a finger with sufficiently high resolution which is then converted into a 2-D rolled equivalent image. In this paper, we describe certain quantitative measures evaluating scanner performance. Specifically, we use some image software components developed by the National Institute of Standards and Technology, to derive our performance metrics. Out of the eleven identified metrics, three were found to be most suitable for evaluating scanner performance. A comparison is also made between 2D fingerprint images obtained by the traditional means and the 2D images obtained after unrolling the 3D scans and the quality of the acquired scans is quantified using the metrics.

Original languageEnglish
Title of host publicationBiometric Technology for Human Identification IV
StatePublished - 2007
EventBiometric Technology for Human Identification IV - Orlando, FL, United States
Duration: Apr 9 2007Apr 10 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


ConferenceBiometric Technology for Human Identification IV
Country/TerritoryUnited States
CityOrlando, FL


  • 3-D fingerprints
  • Biometrics
  • Fingerprint acquisition
  • Image quality
  • Scanner performance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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