Reactive wetting of AgCuTi filler metal on the TiAl-based alloy substrate

Yulong Li; Wen Liu; Dusan P. Sekulic; Peng He

doi:10.1016/j.apsusc.2012.07.047

Reactive wetting of AgCuTi filler metal on the TiAl-based alloy substrate

Yulong Li, Wen Liu, Dusan P. Sekulic, Peng He

Research output: Contribution to journal › Article › peer-review

39 Scopus citations

Abstract

Reactive wetting of the AgCuTi over a TiAl substrate was investigated by hot stage microscopy in real-time in situ, under a high purity argon atmosphere at an elevated temperature (∼1270 K level). The results show: wetting process of the AgCuTi alloy on both polished and rough surfaces feature similar kinetics. Three stages were identified, (i) initial stage upon the onset of melting characterized with triple line essentially stationary or contracting, (ii) middle stage featuring almost linear spreading kinetics, and (iii) asymptotic stage with kinetics with diminishing spreading rate. Wetting kinetics within the main spreading stage features the power law of R ⁿ ∼ t (n = 1). During spreading, Ag-based solid solution and Al-Cu-Ti ternary intermetallics were formed along the interface within the joint zone. Therefore, the spreading of AgCuTi filler over TiAl is highly reactive and the topographical modification of the base metal surface may have a minimal impact on wetting process.

Original language	English
Pages (from-to)	343-348
Number of pages	6
Journal	Applied Surface Science
Volume	259
DOIs	https://doi.org/10.1016/j.apsusc.2012.07.047
State	Published - Oct 15 2012

Bibliographical note

Funding Information:
This work was supported by National Natural Science Foundation of China (Nos. 50975062 , 50905082 ), Science Foundation of Educational Department of Jiangxi Province (No. GJJ10033 ) and the Funding for Young Scientists of Jiangxi Province (No. 2010DQ01000 ), China. The first author acknowledges support from the China Scholarship Council for a visiting scholar position in the Brazing Laboratory of the College of Engineering, University of Kentucky.

Funding

This work was supported by National Natural Science Foundation of China (Nos. 50975062 , 50905082 ), Science Foundation of Educational Department of Jiangxi Province (No. GJJ10033 ) and the Funding for Young Scientists of Jiangxi Province (No. 2010DQ01000 ), China. The first author acknowledges support from the China Scholarship Council for a visiting scholar position in the Brazing Laboratory of the College of Engineering, University of Kentucky.

Funders	Funder number
Funding for Young Scientists of Jiangxi Province	2010DQ01000
Science Foundation of Educational Department of Jiangxi Province	GJJ10033
University of Kentucky
National Natural Science Foundation of China (NSFC)	50905082, 50975062
China Scholarship Council

Keywords

Brazing
Interfaces
Microstructure
TiAl
Wetting kinetics

ASJC Scopus subject areas

General Chemistry
Condensed Matter Physics
General Physics and Astronomy
Surfaces and Interfaces
Surfaces, Coatings and Films

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10.1016/j.apsusc.2012.07.047

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title = "Reactive wetting of AgCuTi filler metal on the TiAl-based alloy substrate",

abstract = " Reactive wetting of the AgCuTi over a TiAl substrate was investigated by hot stage microscopy in real-time in situ, under a high purity argon atmosphere at an elevated temperature (∼1270 K level). The results show: wetting process of the AgCuTi alloy on both polished and rough surfaces feature similar kinetics. Three stages were identified, (i) initial stage upon the onset of melting characterized with triple line essentially stationary or contracting, (ii) middle stage featuring almost linear spreading kinetics, and (iii) asymptotic stage with kinetics with diminishing spreading rate. Wetting kinetics within the main spreading stage features the power law of R n ∼ t (n = 1). During spreading, Ag-based solid solution and Al-Cu-Ti ternary intermetallics were formed along the interface within the joint zone. Therefore, the spreading of AgCuTi filler over TiAl is highly reactive and the topographical modification of the base metal surface may have a minimal impact on wetting process.",

keywords = "Brazing, Interfaces, Microstructure, TiAl, Wetting kinetics",

author = "Yulong Li and Wen Liu and Sekulic, {Dusan P.} and Peng He",

note = "Funding Information: This work was supported by National Natural Science Foundation of China (Nos. 50975062 , 50905082 ), Science Foundation of Educational Department of Jiangxi Province (No. GJJ10033 ) and the Funding for Young Scientists of Jiangxi Province (No. 2010DQ01000 ), China. The first author acknowledges support from the China Scholarship Council for a visiting scholar position in the Brazing Laboratory of the College of Engineering, University of Kentucky.",

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doi = "10.1016/j.apsusc.2012.07.047",

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AU - Li, Yulong

AU - Liu, Wen

AU - Sekulic, Dusan P.

AU - He, Peng

N1 - Funding Information: This work was supported by National Natural Science Foundation of China (Nos. 50975062 , 50905082 ), Science Foundation of Educational Department of Jiangxi Province (No. GJJ10033 ) and the Funding for Young Scientists of Jiangxi Province (No. 2010DQ01000 ), China. The first author acknowledges support from the China Scholarship Council for a visiting scholar position in the Brazing Laboratory of the College of Engineering, University of Kentucky.

PY - 2012/10/15

Y1 - 2012/10/15

N2 - Reactive wetting of the AgCuTi over a TiAl substrate was investigated by hot stage microscopy in real-time in situ, under a high purity argon atmosphere at an elevated temperature (∼1270 K level). The results show: wetting process of the AgCuTi alloy on both polished and rough surfaces feature similar kinetics. Three stages were identified, (i) initial stage upon the onset of melting characterized with triple line essentially stationary or contracting, (ii) middle stage featuring almost linear spreading kinetics, and (iii) asymptotic stage with kinetics with diminishing spreading rate. Wetting kinetics within the main spreading stage features the power law of R n ∼ t (n = 1). During spreading, Ag-based solid solution and Al-Cu-Ti ternary intermetallics were formed along the interface within the joint zone. Therefore, the spreading of AgCuTi filler over TiAl is highly reactive and the topographical modification of the base metal surface may have a minimal impact on wetting process.

AB - Reactive wetting of the AgCuTi over a TiAl substrate was investigated by hot stage microscopy in real-time in situ, under a high purity argon atmosphere at an elevated temperature (∼1270 K level). The results show: wetting process of the AgCuTi alloy on both polished and rough surfaces feature similar kinetics. Three stages were identified, (i) initial stage upon the onset of melting characterized with triple line essentially stationary or contracting, (ii) middle stage featuring almost linear spreading kinetics, and (iii) asymptotic stage with kinetics with diminishing spreading rate. Wetting kinetics within the main spreading stage features the power law of R n ∼ t (n = 1). During spreading, Ag-based solid solution and Al-Cu-Ti ternary intermetallics were formed along the interface within the joint zone. Therefore, the spreading of AgCuTi filler over TiAl is highly reactive and the topographical modification of the base metal surface may have a minimal impact on wetting process.

KW - Brazing

KW - Interfaces

KW - Microstructure

KW - TiAl

KW - Wetting kinetics

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JO - Applied Surface Science

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ER -

Reactive wetting of AgCuTi filler metal on the TiAl-based alloy substrate

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

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