Reactive wetting of the AgCuTi over a TiAl substrate was investigated by hot stage microscopy in real-time in situ, under a high purity argon atmosphere at an elevated temperature (∼1270 K level). The results show: wetting process of the AgCuTi alloy on both polished and rough surfaces feature similar kinetics. Three stages were identified, (i) initial stage upon the onset of melting characterized with triple line essentially stationary or contracting, (ii) middle stage featuring almost linear spreading kinetics, and (iii) asymptotic stage with kinetics with diminishing spreading rate. Wetting kinetics within the main spreading stage features the power law of R n ∼ t (n = 1). During spreading, Ag-based solid solution and Al-Cu-Ti ternary intermetallics were formed along the interface within the joint zone. Therefore, the spreading of AgCuTi filler over TiAl is highly reactive and the topographical modification of the base metal surface may have a minimal impact on wetting process.
|Number of pages||6|
|Journal||Applied Surface Science|
|State||Published - Oct 15 2012|
Bibliographical noteFunding Information:
This work was supported by National Natural Science Foundation of China (Nos. 50975062 , 50905082 ), Science Foundation of Educational Department of Jiangxi Province (No. GJJ10033 ) and the Funding for Young Scientists of Jiangxi Province (No. 2010DQ01000 ), China. The first author acknowledges support from the China Scholarship Council for a visiting scholar position in the Brazing Laboratory of the College of Engineering, University of Kentucky.
- Wetting kinetics
ASJC Scopus subject areas
- Chemistry (all)
- Condensed Matter Physics
- Physics and Astronomy (all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films