Reduction Kinetics of Low-Cost Cu/Fe-Based Oxygen Carriers in Chemical Looping Mode

Engineering

• Oxygen Carrier 100%
• Low Cost 100%
• Design 66%
• Low-Temperature 66%
• Chemical Looping 66%
• Reactivity 66%
• High Temperature 66%
• Kinetic Parameter 66%
• Mechanisms 33%
• Cyclic Stability 33%
• Temperature Range 33%
• Boundary Layer 33%
• Temperature Condition 33%
• Oxygen Transfer Rate 33%
• Core Model 33%
• Flow Curve 33%
• Data Reduction 33%
• Activation Energy 33%
• Heat Transfer 33%
• Shrinkage 33%
• Sintering 33%
• Gaseous Diffusion 33%

Chemical Engineering

• Oxygen 100%
• Temperature 100%
• Chemical Kinetics Characteristics 100%
• Ore 60%
• Copper 40%
• Chemical Looping Combustion 40%
• Oxide 20%
• Heat Transfer 20%
• Hematite 20%

Material Science

• Temperature 100%
• Copper 40%
• Particle 20%
• Shrinkage 20%
• Activation Energy 20%
• Boundary Layer 20%
• Hematite 20%
• Oxide Compound 20%
• Materials 20%
• Gas 20%
• Raw Material 20%
• Sintering 20%