TY - GEN
T1 - Remote controlled valves for flow control in LTCC-based microfluidic devices
AU - Eitel, Richard E.
AU - Zhang, Wenli
AU - Satarkar, Nitin
AU - Hilt, J. Zach
PY - 2009
Y1 - 2009
N2 - Microfluidic systems are attractive for a number of Lab-on-Chip (LOC) and micro-Total Analysis System (juTAS) based applications. However, the overall complexity and level of integration of these devices is limited by the need to have a significant number of off-chip mechanical or pneumatic components; particularly in the area of fluid flow control and pumping. Hydrogels posses a number of interesting properties and can be tailored to respond to a wide range of different external stimuli. In this work, nanocomposite hydrogels have been developed which respond to alternating magnetic field (AMF). These nanocomposite hydrogels have been optimized for integration into an LTCC based microfluidic system to achieve remote control (RC) of on-chip fluid flow without the requirement for external valves or solenoids. The integration and remote operation of an RC hydrogel valves in an LTCC microfluidic device is presented.
AB - Microfluidic systems are attractive for a number of Lab-on-Chip (LOC) and micro-Total Analysis System (juTAS) based applications. However, the overall complexity and level of integration of these devices is limited by the need to have a significant number of off-chip mechanical or pneumatic components; particularly in the area of fluid flow control and pumping. Hydrogels posses a number of interesting properties and can be tailored to respond to a wide range of different external stimuli. In this work, nanocomposite hydrogels have been developed which respond to alternating magnetic field (AMF). These nanocomposite hydrogels have been optimized for integration into an LTCC based microfluidic system to achieve remote control (RC) of on-chip fluid flow without the requirement for external valves or solenoids. The integration and remote operation of an RC hydrogel valves in an LTCC microfluidic device is presented.
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M3 - Conference contribution
AN - SCOPUS:84879854134
SN - 9781615673742
T3 - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
SP - 163
EP - 166
BT - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
T2 - 5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009
Y2 - 21 April 2009 through 23 April 2009
ER -