Spreading kinetics of liquid solders over an intermetallic solid surface. Part 2: Lead-free solders

H. Zhao; H. Q. Wang; D. P. Sekulic; Y. Y. Qian

doi:10.1007/s11664-009-0870-8

Spreading kinetics of liquid solders over an intermetallic solid surface. Part 2: Lead-free solders

H. Zhao, H. Q. Wang, D. P. Sekulic, Y. Y. Qian

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

This study is devoted to a phenomenological and quantitative investigation of the physics of spreading of lead-free solder systems (Sn, Sn-0.7Cu, and Sn-3.5Ag) over Cu ₆Sn ₅/Cu ₃Sn/Cu substrates. Wetting kinetics was studied using real-time in situ monitoring of the triple-line kinetics under a controlled atmosphere. Three different intermetallic (IMC) substrates were used for this investigation. It was found that the grain size of the deposited IMC compound coating has a sizable influence on the triple-line movement of the liquid solders considered. More pronounced spreading of solders on IMC substrates was observed for all lead-free solders over an intermetallic with the smallest grain size. Lead-free solder spreading over IMC surfaces exposed to aging at elevated temperatures, hence featuring larger grain size, did not feature a significant improvement of wettability when compared with the behavior of the same solders on virgin copper substrates.

Original language	English
Pages (from-to)	1846-1854
Number of pages	9
Journal	Journal of Electronic Materials
Volume	38
Issue number	9
DOIs	https://doi.org/10.1007/s11664-009-0870-8
State	Published - Sep 2009

Bibliographical note

Funding Information:
This work has been funded through grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010.

Funding

This work has been funded through grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010.

Funders	Funder number
Kentucky Science and Engineering Foundation	KSEF-1490-RDE-010, KSEF-829-RDE-007

Keywords

Intermetallics
Lead-free solders
Spreading

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-009-0870-8

Cite this

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title = "Spreading kinetics of liquid solders over an intermetallic solid surface. Part 2: Lead-free solders",

abstract = "This study is devoted to a phenomenological and quantitative investigation of the physics of spreading of lead-free solder systems (Sn, Sn-0.7Cu, and Sn-3.5Ag) over Cu 6Sn 5/Cu 3Sn/Cu substrates. Wetting kinetics was studied using real-time in situ monitoring of the triple-line kinetics under a controlled atmosphere. Three different intermetallic (IMC) substrates were used for this investigation. It was found that the grain size of the deposited IMC compound coating has a sizable influence on the triple-line movement of the liquid solders considered. More pronounced spreading of solders on IMC substrates was observed for all lead-free solders over an intermetallic with the smallest grain size. Lead-free solder spreading over IMC surfaces exposed to aging at elevated temperatures, hence featuring larger grain size, did not feature a significant improvement of wettability when compared with the behavior of the same solders on virgin copper substrates.",

keywords = "Intermetallics, Lead-free solders, Spreading",

author = "H. Zhao and Wang, {H. Q.} and Sekulic, {D. P.} and Qian, {Y. Y.}",

note = "Funding Information: This work has been funded through grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010.",

year = "2009",

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doi = "10.1007/s11664-009-0870-8",

language = "English",

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T2 - Lead-free solders

AU - Zhao, H.

AU - Wang, H. Q.

AU - Sekulic, D. P.

AU - Qian, Y. Y.

N1 - Funding Information: This work has been funded through grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010.

PY - 2009/9

Y1 - 2009/9

N2 - This study is devoted to a phenomenological and quantitative investigation of the physics of spreading of lead-free solder systems (Sn, Sn-0.7Cu, and Sn-3.5Ag) over Cu 6Sn 5/Cu 3Sn/Cu substrates. Wetting kinetics was studied using real-time in situ monitoring of the triple-line kinetics under a controlled atmosphere. Three different intermetallic (IMC) substrates were used for this investigation. It was found that the grain size of the deposited IMC compound coating has a sizable influence on the triple-line movement of the liquid solders considered. More pronounced spreading of solders on IMC substrates was observed for all lead-free solders over an intermetallic with the smallest grain size. Lead-free solder spreading over IMC surfaces exposed to aging at elevated temperatures, hence featuring larger grain size, did not feature a significant improvement of wettability when compared with the behavior of the same solders on virgin copper substrates.

AB - This study is devoted to a phenomenological and quantitative investigation of the physics of spreading of lead-free solder systems (Sn, Sn-0.7Cu, and Sn-3.5Ag) over Cu 6Sn 5/Cu 3Sn/Cu substrates. Wetting kinetics was studied using real-time in situ monitoring of the triple-line kinetics under a controlled atmosphere. Three different intermetallic (IMC) substrates were used for this investigation. It was found that the grain size of the deposited IMC compound coating has a sizable influence on the triple-line movement of the liquid solders considered. More pronounced spreading of solders on IMC substrates was observed for all lead-free solders over an intermetallic with the smallest grain size. Lead-free solder spreading over IMC surfaces exposed to aging at elevated temperatures, hence featuring larger grain size, did not feature a significant improvement of wettability when compared with the behavior of the same solders on virgin copper substrates.

KW - Intermetallics

KW - Lead-free solders

KW - Spreading

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Spreading kinetics of liquid solders over an intermetallic solid surface. Part 2: Lead-free solders

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

Access to Document

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