Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder

H. Zhao, H. Q. Wang, D. P. Sekulic, Y. Y. Qian

Research output: Contribution to journalArticlepeer-review

18 Scopus citations


This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu 6Sn 5/Cu 3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu 6Sn 5/Cu 3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.

Original languageEnglish
Pages (from-to)1838-1845
Number of pages8
JournalJournal of Electronic Materials
Issue number9
StatePublished - Sep 2009

Bibliographical note

Funding Information:
This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.


  • Intermetallics
  • Solders
  • Spreading

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering


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