Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder

H. Zhao; H. Q. Wang; D. P. Sekulic; Y. Y. Qian

doi:10.1007/s11664-009-0869-1

Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder

H. Zhao, H. Q. Wang, D. P. Sekulic, Y. Y. Qian

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu ₆Sn ₅/Cu ₃Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu ₆Sn ₅/Cu ₃Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.

Original language	English
Pages (from-to)	1838-1845
Number of pages	8
Journal	Journal of Electronic Materials
Volume	38
Issue number	9
DOIs	https://doi.org/10.1007/s11664-009-0869-1
State	Published - Sep 2009

Bibliographical note

Funding Information:
This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.

Funding

This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.

Funders	Funder number
Kentucky Science and Engineering Foundation	KSEF-1490-RDE-010, KSEF-829-RDE-007

Keywords

Intermetallics
Solders
Spreading

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-009-0869-1

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title = "Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder",

abstract = "This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu 6Sn 5/Cu 3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu 6Sn 5/Cu 3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.",

keywords = "Intermetallics, Solders, Spreading",

author = "H. Zhao and Wang, {H. Q.} and Sekulic, {D. P.} and Qian, {Y. Y.}",

note = "Funding Information: This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.",

year = "2009",

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language = "English",

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AU - Zhao, H.

AU - Wang, H. Q.

AU - Sekulic, D. P.

AU - Qian, Y. Y.

N1 - Funding Information: This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.

PY - 2009/9

Y1 - 2009/9

N2 - This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu 6Sn 5/Cu 3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu 6Sn 5/Cu 3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.

AB - This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu 6Sn 5/Cu 3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu 6Sn 5/Cu 3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.

KW - Intermetallics

KW - Solders

KW - Spreading

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JF - Journal of Electronic Materials

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Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

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