This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu 6Sn 5/Cu 3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu 6Sn 5/Cu 3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.
|Number of pages||8|
|Journal||Journal of Electronic Materials|
|State||Published - Sep 2009|
Bibliographical noteFunding Information:
This work has been funded through Grants from the Kentucky Science and Engineering Foundation # KSEF-829-RDE-007 and KSEF-1490-RDE-010. Assistance of Dr. Rong Xing in conducting XRD studies is gratefully acknowledged.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Materials Chemistry
- Electrical and Electronic Engineering