Abstract
Increasing numbers of under-hood sensors and power electronics modules are becoming standard in both commercial and military vehicles. In order to function reliably, these technologies require a dedicated and dynamic cooling system, such as liquid jet impingement. An experimental study has been conducted focusing on the utilization of a variable area jet discharge manifold to enable improved spent fluid management. Tests employed expanding manifolds at angles between 2.5 and 7.5 degrees, volumetric flow rates of up to 14.72 lpm (3.889 gpm), pitches of 4 and 6 nozzle diameters, and staggered arrays of jets. A unique method of translation in two orthogonal axes was used to provide experimentally measured two-dimensional maps of heat transfer coefficient. The heat source used simulated a power electronics module producing up to 500 W. Water was used as the working fluid. This spent fluid management scheme was seen to have a notable effect on the temperature uniformity and heat transfer coefficients.
Original language | English |
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Title of host publication | Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 |
Pages | 410-416 |
Number of pages | 7 |
ISBN (Electronic) | 9781538612729 |
DOIs | |
State | Published - Jul 24 2018 |
Event | 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States Duration: May 29 2018 → Jun 1 2018 |
Publication series
Name | Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 |
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Conference
Conference | 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 |
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Country/Territory | United States |
City | San Diego |
Period | 5/29/18 → 6/1/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
Keywords
- Jet Impingement
- Power Electronics Cooling
ASJC Scopus subject areas
- Fluid Flow and Transfer Processes
- Electrical and Electronic Engineering
- Mechanics of Materials
- Safety, Risk, Reliability and Quality