Staggered and In-line Submerged Jet Arrays for Power Electronics Using Variable Area Discharge Manifolds: Part i - Experimental

Michael A. Henry, Kayla E. Reid, Sushil H. Bhavnani, Roy W. Knight, John F. Maddox, William D. Brannon

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Increasing numbers of under-hood sensors and power electronics modules are becoming standard in both commercial and military vehicles. In order to function reliably, these technologies require a dedicated and dynamic cooling system, such as liquid jet impingement. An experimental study has been conducted focusing on the utilization of a variable area jet discharge manifold to enable improved spent fluid management. Tests employed expanding manifolds at angles between 2.5 and 7.5 degrees, volumetric flow rates of up to 14.72 lpm (3.889 gpm), pitches of 4 and 6 nozzle diameters, and staggered arrays of jets. A unique method of translation in two orthogonal axes was used to provide experimentally measured two-dimensional maps of heat transfer coefficient. The heat source used simulated a power electronics module producing up to 500 W. Water was used as the working fluid. This spent fluid management scheme was seen to have a notable effect on the temperature uniformity and heat transfer coefficients.

Original languageEnglish
Title of host publicationProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Pages410-416
Number of pages7
ISBN (Electronic)9781538612729
DOIs
StatePublished - Jul 24 2018
Event17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States
Duration: May 29 2018Jun 1 2018

Publication series

NameProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018

Conference

Conference17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Country/TerritoryUnited States
CitySan Diego
Period5/29/186/1/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

  • Jet Impingement
  • Power Electronics Cooling

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality

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