Staggered and In-Line Submerged Liquid Jet Arrays for Power Electronics Using Variable Area Discharge Manifolds: Part II - Numerical

Kayla E. Reid, Michael A. Henry, Roy W. Knight, Sushil H. Bhavnani, John F. Maddox

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Increasing numbers of under-hood sensors and power electronics modules are becoming standard in both commercial and military vehicles. In order to function reliably, these technologies require a dedicated and dynamic cooling system, such as liquid jet impingement. In a jet array, the spent fluid from upstream jets interact with the downstream jets degrading their performance. In this study, in order to counteract this effect, an expanding manifold, with larger area for flow downstream, was used to allow the spent fluid from upstream jets to be diverted, reducing degradation of the heat transfer coefficients downstream. A numerical study of liquid jet impingement utilizing water as the working fluid was performed to examine the heat transfer rate in staggered jet arrays compared to inline jet arrays. The simulations performed examined manifold angles between 0 and 10 degrees, jet Reynolds numbers between 5600 and 14000, and pitches of 2.5, 3, 4.5, and 6 nozzle diameters. The simulations revealed details of the complicated interaction between the jets, their fountain regions and the crossflow. The angled manifold systems had greater temperature uniformity and increased heat transfer coefficients compared to systems with constant area manifolds.

Original languageEnglish
Title of host publicationProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Pages417-423
Number of pages7
ISBN (Electronic)9781538612729
DOIs
StatePublished - Jul 24 2018
Event17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States
Duration: May 29 2018Jun 1 2018

Publication series

NameProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018

Conference

Conference17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Country/TerritoryUnited States
CitySan Diego
Period5/29/186/1/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

  • Staggered jet array
  • angled expanding manifold
  • fountain region effects
  • jet impingement
  • spent flow management

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality

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