Stress Analysis of Wiresaw Slicing Piezoelectric Materials

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Using linear piezoelectricity theory, the stress and electric potential fields in a half infinite piezoelectric material under anti-plane mechanical loading in wiresaw slicing process has been studied by using appropriate boundary conditions and contact mechanics. Both electric field and electric displacement field are singular at the edges of the contact zone between wire and workpiece. The singularity of electric displacement arises from the electric loading and electro-mechanical interaction. Similar to the conventional contact mechanics, stress singularity occurs due to the contribution of both mechanical and electric loading. At a given mechanical loading, electric loading can either increase or decrease the stress applied to the piezoelectric half space in the slicing process, which depends on the relative direction of the electric field to that of mechanical loading.

Original languageEnglish
Title of host publicationPackaging of Electronic and Photonic Devices
Pages243-248
Number of pages6
ISBN (Electronic)9780791819302
DOIs
StatePublished - 2000
EventASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000 - Orlando, United States
Duration: Nov 5 2000Nov 10 2000

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume2000-AG

Conference

ConferenceASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Country/TerritoryUnited States
CityOrlando
Period11/5/0011/10/00

Bibliographical note

Publisher Copyright:
© 2000 by ASME.

ASJC Scopus subject areas

  • Mechanical Engineering

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