Stress-assisted-electrochemical corrosion of cu-based bulk metallic glass

Ding Li, Mimi Yang, Fuqian Yang, Peter K. Liaw

Research output: Contribution to journalArticlepeer-review

3 Scopus citations


Using the microindentation test, the stress-assisted-electrochemical corrosion of Cu46.25Zr45.25AI7.5Er1 bulk metallic glass (BMG) was studied in a 10 wt% NaCl electrolyte. The microindentation was performed in an indentation load range of 500 to 4000 mN to create shear bands over the deformation zone. Electric current of various densities was passed through the Indented BMGs to evaluate the effect of shear bands and localized deformation on the electrochemical corrosion of the BMGs. Surface pits always Initiated from the shear-banding zone and the contactedges between the indenter and the BMGs, and the size of the corroded zone grew with the increase In the polarization time, the indentation load, and the current density. Wormlike amorphous whiskers were formed over the corroded zone, and the density of the wormlike whiskers increased with the current density and polarization time.

Original languageEnglish
Pages (from-to)592-597
Number of pages6
JournalJournal of Materials Research
Issue number3
StatePublished - Mar 2010

Bibliographical note

Funding Information:
This work is supported by the National Science Foundation through the grant CMMI 0800018, the Kentucky Science and Engineering Foundation through grant agreement KSEF-148-502-06-180, and NSF-IMI-ANSWER Fellowship.

ASJC Scopus subject areas

  • Materials Science (all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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