Stress distribution within spherical particles undergoing electrochemical insertion and extraction

Mark W. Verbrugge, Yang Tse Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

41 Scopus citations

Abstract

We examine the effects of surface tension and surface modulus on diffusion-induced stress (DIS) within spherical nano-particles undergoing electrochemical insertion and extraction. By assuming small mechanical deformation characterized by isotropic linear elasticity and a dilute solution within the solid state for the diffusion problem, we are able to generate analytic solutions for the combined problem of mechanical deformation and diffusion of the insertion species. The results may be viewed as benchmark calculations that help one to understand how stress evolves within insertion electrodes. Both the magnitude and distribution of stress are affected by the surface mechanics if the particle diameter is sufficiently small; for example, during insertion, the tensile state at the center of spherical particles may be significantly reduced in magnitude or even converted from hydrostatic tension to compression with decreasing particle radius. This reduction in tensile stress motivates the examination of reducing particle size so as to improve the mechanical stability of electrode materials.

Original languageEnglish
Title of host publicationECS Transactions - Tutorial Symposium on Electrochemical Engineering, in Honor of Professor John Newman's 70th Birthday
Pages127-139
Number of pages13
Edition13
DOIs
StatePublished - 2009
EventTutorial Symposium on Electrochemical Engineering, in Honor of Professor John Newman's 70th Birthday- 214th ECS Meeting - Honolulu, HI, United States
Duration: Oct 12 2008Oct 17 2008

Publication series

NameECS Transactions
Number13
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceTutorial Symposium on Electrochemical Engineering, in Honor of Professor John Newman's 70th Birthday- 214th ECS Meeting
Country/TerritoryUnited States
CityHonolulu, HI
Period10/12/0810/17/08

ASJC Scopus subject areas

  • General Engineering

Fingerprint

Dive into the research topics of 'Stress distribution within spherical particles undergoing electrochemical insertion and extraction'. Together they form a unique fingerprint.

Cite this