Study of the impact performance of solder joints by high-velocity impact tests

Ning Zhang, Yaowu Shi, Fu Guo, Fuqian Yang

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

The impact behavior of solder joints was studied using three different high-velocity impact tests: the U-notch Charpy impact test, the no-notch Charpy impact test, and a laboratory-designed drop test. The solder joints were made of five solder alloys, Sn-37Pb, Sn-3.8Ag-0.7Cu, Sn-2.0Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and Sn-0.7Ag-0.7Cu (in wt.%), in which the traditional Cu/solder/Cu butt joint was used. All three impact tests gave the same trend of the impact behavior of the solder joints, with the Sn-37Pb joints having the highest impact resistance and the Sn-3.8Ag-0.7Cu joints having the lowest impact resistance. For the lead-free joints, the Sn-1.0Ag-0.7Cu joints had better impact resistance than the Sn-2.0Ag-0.7Cu joints, and the Sn-2.0Ag-0.7Cu joints better than the Sn-0.7Ag-0.7Cu joints. The impact behavior was correlated well to the fracture morphologies observed by scanning electron microscopy (SEM). Comparison of the three tests showed that the no-notch Charpy impact test is a promising method for evaluating the drop performance of solder joints.

Original languageEnglish
Pages (from-to)2536-2543
Number of pages8
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
StatePublished - Dec 2010

Bibliographical note

Funding Information:
The present work was performed under the financial support of the National 863 Hi-Tech Scheme (No. 2002AA322040) and the key program for the 11th Five-Year Plan (No. 2006BAE03B02) of the China Department of Science and Technology. The authors would like to give special thanks to the China Scholarship Council for funding support.

Funding

The present work was performed under the financial support of the National 863 Hi-Tech Scheme (No. 2002AA322040) and the key program for the 11th Five-Year Plan (No. 2006BAE03B02) of the China Department of Science and Technology. The authors would like to give special thanks to the China Scholarship Council for funding support.

FundersFunder number
National 863 Hi-Tech Scheme2002AA322040
key program for the 11th Five-Year Plan

    Keywords

    • Impact tests
    • impact resistance
    • low-Ag lead-free solders
    • no-notch butt-jointed specimens

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

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