The impact behavior of solder joints was studied using three different high-velocity impact tests: the U-notch Charpy impact test, the no-notch Charpy impact test, and a laboratory-designed drop test. The solder joints were made of five solder alloys, Sn-37Pb, Sn-3.8Ag-0.7Cu, Sn-2.0Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and Sn-0.7Ag-0.7Cu (in wt.%), in which the traditional Cu/solder/Cu butt joint was used. All three impact tests gave the same trend of the impact behavior of the solder joints, with the Sn-37Pb joints having the highest impact resistance and the Sn-3.8Ag-0.7Cu joints having the lowest impact resistance. For the lead-free joints, the Sn-1.0Ag-0.7Cu joints had better impact resistance than the Sn-2.0Ag-0.7Cu joints, and the Sn-2.0Ag-0.7Cu joints better than the Sn-0.7Ag-0.7Cu joints. The impact behavior was correlated well to the fracture morphologies observed by scanning electron microscopy (SEM). Comparison of the three tests showed that the no-notch Charpy impact test is a promising method for evaluating the drop performance of solder joints.
|Number of pages||8|
|Journal||Journal of Electronic Materials|
|State||Published - Dec 2010|
Bibliographical noteFunding Information:
The present work was performed under the financial support of the National 863 Hi-Tech Scheme (No. 2002AA322040) and the key program for the 11th Five-Year Plan (No. 2006BAE03B02) of the China Department of Science and Technology. The authors would like to give special thanks to the China Scholarship Council for funding support.
- Impact tests
- impact resistance
- low-Ag lead-free solders
- no-notch butt-jointed specimens
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry