System integration and packaging

Wen Ko, Peng Wang, Shem Lachhman

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

2 Scopus citations


The human body is a harsh environment; bodily fluids are highly conductive and contain many chemical and biochemical species that are potentially harmful to implanted electronics and MEMS devices and components. At the same time, the body is a complex delicate living system that may be harmed by the material, shape, and size of the implant devices. The package is the outmost part of the implant that interfaces with the body; it has to protect the device from bodily fluids while protecting the body from any harmful effects of the packaged implant device.

Original languageEnglish
Title of host publicationImplantable Biomedical Microsystems
Subtitle of host publicationDesign Principles and Applications
Number of pages24
ISBN (Electronic)9780323261906
StatePublished - Jan 27 2015

Bibliographical note

Funding Information:
The kind guidance and work on pathological evaluation of tissue samples of Professor James Anderson of the Medical School, CWRU, is deeply appreciated. The technical help from the MEMS/NEMS group of EECS Department, CWRU, and APT Center, VA medical Center of Cleveland, and the technical guidance and editorial help of Professor Christian A. Zorman of EECS Department, CWR University, are gratefully acknowledged. The project described was supported by Award Number 1I01RX000443-01A2 from the Rehabilitation Research & Development Service of the VA Office of Research and Development, Case Western Reserve University, and the Cleveland Clinic.

Publisher Copyright:
© 2015 Elsevier Inc. All rights reserved..


  • Microimplants
  • Neuroprosthesis
  • Nonhermetic Micropackage
  • Parylene-C
  • Polydimethylsiloxane

ASJC Scopus subject areas

  • Medicine (all)
  • Health Professions (all)


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