System integration and packaging

Wen Ko, Peng Wang, Shem Lachhman

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

2 Scopus citations

Abstract

The human body is a harsh environment; bodily fluids are highly conductive and contain many chemical and biochemical species that are potentially harmful to implanted electronics and MEMS devices and components. At the same time, the body is a complex delicate living system that may be harmed by the material, shape, and size of the implant devices. The package is the outmost part of the implant that interfaces with the body; it has to protect the device from bodily fluids while protecting the body from any harmful effects of the packaged implant device.

Original languageEnglish
Title of host publicationImplantable Biomedical Microsystems
Subtitle of host publicationDesign Principles and Applications
Pages113-136
Number of pages24
ISBN (Electronic)9780323261906
DOIs
StatePublished - Jan 27 2015

Bibliographical note

Publisher Copyright:
© 2015 Elsevier Inc. All rights reserved..

Keywords

  • Microimplants
  • Neuroprosthesis
  • Nonhermetic Micropackage
  • Parylene-C
  • Polydimethylsiloxane

ASJC Scopus subject areas

  • General Medicine
  • General Health Professions

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