Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Wenbin Tang; Xu Long; Fuqian Yang

doi:10.1016/j.microrel.2019.113555

Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Wenbin Tang, Xu Long, Fuqian Yang

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The annealing temperature is in a range of 75 °C to 230 °C, which covers both liquid and solid states of SAC305 solder material. There are three intermetallic compounds (IMCs) of Ag₃Sn, Cu₃Sn and Cu₆Sn₅ formed in the solder joints. The tensile strength of SAC305 solder joints decreases from 27.3 MPa to 18.9 MPa with the increase of the annealing temperature from 210 °C to 230 °C likely due to the decrease of the volume fractions of the IMC particles of Ag₃Sn and Cu₆Sn₅ and the dislocation density. The average sizes of the IMC particles of Ag₃Sn and Cu₃Sn in the solder joints annealed at a temperature higher than the melting temperature are greater than the corresponding ones in the solder joints annealed at a temperature below the melting temperature.

Original language	English
Article number	113555
Journal	Microelectronics Reliability
Volume	104
DOIs	https://doi.org/10.1016/j.microrel.2019.113555
State	Published - Jan 2020

Bibliographical note

Publisher Copyright:
© 2019 Elsevier Ltd

Funding

This work was supported by the National Natural Science Foundation of China (No. 51508464 ), the Natural Science Foundation of Shaanxi Province (No. 2017JM1013 ), the Astronautics Supporting Technology Foundation of China (No. 2019-HT-XG ), and the Fundamental Research Funds for the Central Universities (No. 3102018ZY015 ).

Funders	Funder number
Astronautics Supporting Technology Foundation of China	2019-HT-XG
National Natural Science Foundation of China (NSFC)	51508464
Natural Science Foundation of Shaanxi Province	2017JM1013
Fundamental Research Funds for the Central Universities	3102018ZY015

Keywords

Annealing
Liquid state
Microstructure
Solder joint
Solid state
Tensile deformation

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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title = "Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature",

abstract = "The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The annealing temperature is in a range of 75 °C to 230 °C, which covers both liquid and solid states of SAC305 solder material. There are three intermetallic compounds (IMCs) of Ag3Sn, Cu3Sn and Cu6Sn5 formed in the solder joints. The tensile strength of SAC305 solder joints decreases from 27.3 MPa to 18.9 MPa with the increase of the annealing temperature from 210 °C to 230 °C likely due to the decrease of the volume fractions of the IMC particles of Ag3Sn and Cu6Sn5 and the dislocation density. The average sizes of the IMC particles of Ag3Sn and Cu3Sn in the solder joints annealed at a temperature higher than the melting temperature are greater than the corresponding ones in the solder joints annealed at a temperature below the melting temperature.",

keywords = "Annealing, Liquid state, Microstructure, Solder joint, Solid state, Tensile deformation",

author = "Wenbin Tang and Xu Long and Fuqian Yang",

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doi = "10.1016/j.microrel.2019.113555",

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AU - Long, Xu

AU - Yang, Fuqian

PY - 2020/1

Y1 - 2020/1

N2 - The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The annealing temperature is in a range of 75 °C to 230 °C, which covers both liquid and solid states of SAC305 solder material. There are three intermetallic compounds (IMCs) of Ag3Sn, Cu3Sn and Cu6Sn5 formed in the solder joints. The tensile strength of SAC305 solder joints decreases from 27.3 MPa to 18.9 MPa with the increase of the annealing temperature from 210 °C to 230 °C likely due to the decrease of the volume fractions of the IMC particles of Ag3Sn and Cu6Sn5 and the dislocation density. The average sizes of the IMC particles of Ag3Sn and Cu3Sn in the solder joints annealed at a temperature higher than the melting temperature are greater than the corresponding ones in the solder joints annealed at a temperature below the melting temperature.

AB - The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The annealing temperature is in a range of 75 °C to 230 °C, which covers both liquid and solid states of SAC305 solder material. There are three intermetallic compounds (IMCs) of Ag3Sn, Cu3Sn and Cu6Sn5 formed in the solder joints. The tensile strength of SAC305 solder joints decreases from 27.3 MPa to 18.9 MPa with the increase of the annealing temperature from 210 °C to 230 °C likely due to the decrease of the volume fractions of the IMC particles of Ag3Sn and Cu6Sn5 and the dislocation density. The average sizes of the IMC particles of Ag3Sn and Cu3Sn in the solder joints annealed at a temperature higher than the melting temperature are greater than the corresponding ones in the solder joints annealed at a temperature below the melting temperature.

KW - Annealing

KW - Liquid state

KW - Microstructure

KW - Solder joint

KW - Solid state

KW - Tensile deformation

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Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

Access to Document

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