Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Wenbin Tang, Xu Long, Fuqian Yang

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu (SAC305) solder joints. The annealing temperature is in a range of 75 °C to 230 °C, which covers both liquid and solid states of SAC305 solder material. There are three intermetallic compounds (IMCs) of Ag3Sn, Cu3Sn and Cu6Sn5 formed in the solder joints. The tensile strength of SAC305 solder joints decreases from 27.3 MPa to 18.9 MPa with the increase of the annealing temperature from 210 °C to 230 °C likely due to the decrease of the volume fractions of the IMC particles of Ag3Sn and Cu6Sn5 and the dislocation density. The average sizes of the IMC particles of Ag3Sn and Cu3Sn in the solder joints annealed at a temperature higher than the melting temperature are greater than the corresponding ones in the solder joints annealed at a temperature below the melting temperature.

Original languageEnglish
Article number113555
JournalMicroelectronics Reliability
Volume104
DOIs
StatePublished - Jan 2020

Bibliographical note

Publisher Copyright:
© 2019 Elsevier Ltd

Keywords

  • Annealing
  • Liquid state
  • Microstructure
  • Solder joint
  • Solid state
  • Tensile deformation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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