Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Wenbin Tang, Xu Long, Fuqian Yang

Research output: Contribution to journalArticlepeer-review

18 Scopus citations

Fingerprint

Dive into the research topics of 'Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature'. Together they form a unique fingerprint.

Material Science