The impact of chemical mechanical planarization polishing on a surface textured with deterministic microasperities

Hassan I. Kazi, Lyndon S. Stephens

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper a method for fabricating deterministic microasperities on stainless steel by a photolithographic lift-off technique followed by electrodeposition of nickel is presented. Triangular asperities with an asperity area fraction of 0.20 are deposited onto a stainless steel disk. Chemical mechanical planarization (CMP) polishing is employed for adjusting the heights of the asperities. The surface profiles of the asperities are then characterized. Results show that the surfaces of the as-deposited asperities have a curved profile with one side shorter than the other. The surface profile becomes more uniform after polishing in the CMP machine but polishing tends to round the edges and comers of the asperities. Additionally, polishing results in the grooving of channel in the substrate in between the asperities and chips the asperity walls.

Original languageEnglish
Title of host publicationProceedings of the World Tribology Congress III - 2005
Pages523-524
Number of pages2
DOIs
StatePublished - 2005
Event2005 World Tribology Congress III - Washington, D.C., United States
Duration: Sep 12 2005Sep 16 2005

Publication series

NameProceedings of the World Tribology Congress III - 2005

Conference

Conference2005 World Tribology Congress III
Country/TerritoryUnited States
CityWashington, D.C.
Period9/12/059/16/05

Keywords

  • CMP
  • Lubrication
  • Microasperities
  • Photolithography

ASJC Scopus subject areas

  • Engineering (all)

Fingerprint

Dive into the research topics of 'The impact of chemical mechanical planarization polishing on a surface textured with deterministic microasperities'. Together they form a unique fingerprint.

Cite this