TIM selection for an IGBT cold plate using experimental and numerical modeling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Experimental measurements were used in conjunction with a numerical model to perform an in situ analysis of an IGBT cooling solution with a cold plate utilizing an 85-90°C ethylene glycol-water mixture as the cooling fluid. This process was used to aid in the selection of an appropriate thermal interface material (TIM) for the application. The effects of elevated temperature and thermal cycling on the performance of the TIM were investigated during the selection procedure. Applying the thermal grease with the cold plate at 70°C rather than 30°C caused a reduction in the junction to case resistance of 74% and 78% for the two thermal greases tested.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
StatePublished - 2013
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: Jul 16 2013Jul 18 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume2

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period7/16/137/18/13

Funding

FundersFunder number
National Science Foundation (NSF)

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Networks and Communications
    • Computer Science Applications
    • Hardware and Architecture
    • Information Systems
    • Electronic, Optical and Magnetic Materials

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