TIM selection for an IGBT cold plate using experimental and numerical modeling

John F. Maddox; Roy W. Knight; Sushil H. Bhavnani

doi:10.1115/IPACK2013-73207

TIM selection for an IGBT cold plate using experimental and numerical modeling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

Mechanical and Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Experimental measurements were used in conjunction with a numerical model to perform an in situ analysis of an IGBT cooling solution with a cold plate utilizing an 85-90°C ethylene glycol-water mixture as the cooling fluid. This process was used to aid in the selection of an appropriate thermal interface material (TIM) for the application. The effects of elevated temperature and thermal cycling on the performance of the TIM were investigated during the selection procedure. Applying the thermal grease with the cold plate at 70°C rather than 30°C caused a reduction in the junction to case resistance of 74% and 78% for the two thermal greases tested.

Original language	English
Title of host publication	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs	https://doi.org/10.1115/IPACK2013-73207
State	Published - 2013
Event	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States Duration: Jul 16 2013 → Jul 18 2013

Publication series

Name	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume	2

Conference

Conference	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/Territory	United States
City	Burlingame, CA
Period	7/16/13 → 7/18/13

Funding

Funders	Funder number
National Science Foundation (NSF)

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Networks and Communications
Computer Science Applications
Hardware and Architecture
Information Systems
Electronic, Optical and Magnetic Materials

Access to Document

10.1115/IPACK2013-73207

Cite this

Maddox, J. F., Knight, R. W., & Bhavnani, S. H. (2013). TIM selection for an IGBT cold plate using experimental and numerical modeling. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; Vol. 2). https://doi.org/10.1115/IPACK2013-73207

Maddox, John F. ; Knight, Roy W. ; Bhavnani, Sushil H. / TIM selection for an IGBT cold plate using experimental and numerical modeling. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013).

@inproceedings{a6df236bc1244faaa86dd0d0f35c3c79,

title = "TIM selection for an IGBT cold plate using experimental and numerical modeling",

abstract = "Experimental measurements were used in conjunction with a numerical model to perform an in situ analysis of an IGBT cooling solution with a cold plate utilizing an 85-90°C ethylene glycol-water mixture as the cooling fluid. This process was used to aid in the selection of an appropriate thermal interface material (TIM) for the application. The effects of elevated temperature and thermal cycling on the performance of the TIM were investigated during the selection procedure. Applying the thermal grease with the cold plate at 70°C rather than 30°C caused a reduction in the junction to case resistance of 74% and 78% for the two thermal greases tested.",

author = "Maddox, {John F.} and Knight, {Roy W.} and Bhavnani, {Sushil H.}",

year = "2013",

doi = "10.1115/IPACK2013-73207",

language = "English",

isbn = "9780791855768",

series = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013",

booktitle = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013",

note = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 ; Conference date: 16-07-2013 Through 18-07-2013",

}

Maddox, JF, Knight, RW & Bhavnani, SH 2013, TIM selection for an IGBT cold plate using experimental and numerical modeling. in ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, vol. 2, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, Burlingame, CA, United States, 7/16/13. https://doi.org/10.1115/IPACK2013-73207

TIM selection for an IGBT cold plate using experimental and numerical modeling. / Maddox, John F.; Knight, Roy W.; Bhavnani, Sushil H.
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Knight, Roy W.

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N2 - Experimental measurements were used in conjunction with a numerical model to perform an in situ analysis of an IGBT cooling solution with a cold plate utilizing an 85-90°C ethylene glycol-water mixture as the cooling fluid. This process was used to aid in the selection of an appropriate thermal interface material (TIM) for the application. The effects of elevated temperature and thermal cycling on the performance of the TIM were investigated during the selection procedure. Applying the thermal grease with the cold plate at 70°C rather than 30°C caused a reduction in the junction to case resistance of 74% and 78% for the two thermal greases tested.

AB - Experimental measurements were used in conjunction with a numerical model to perform an in situ analysis of an IGBT cooling solution with a cold plate utilizing an 85-90°C ethylene glycol-water mixture as the cooling fluid. This process was used to aid in the selection of an appropriate thermal interface material (TIM) for the application. The effects of elevated temperature and thermal cycling on the performance of the TIM were investigated during the selection procedure. Applying the thermal grease with the cold plate at 70°C rather than 30°C caused a reduction in the junction to case resistance of 74% and 78% for the two thermal greases tested.

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BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013

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Maddox JF, Knight RW, Bhavnani SH. TIM selection for an IGBT cold plate using experimental and numerical modeling. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013). doi: 10.1115/IPACK2013-73207

TIM selection for an IGBT cold plate using experimental and numerical modeling

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