Time-resolved acoustic microscopy of short cracks

D. Knauss, G. A.D. Briggs, T. Zhai, J. W. Martin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Time-resolved acoustic microscopy has been used to measure the 3-dimensional profile of short cracks (70-200 μm surface length). In order to establish this technique the depth of short cracks in transparent materials were determined. This allows a comparison between the acoustic and direct optical measurements. Subsequently the depth of cracks and the growth of short fatigue cracks in Al-alloy were measured.

Original languageEnglish
Title of host publicationProceedings of the IEEE Ultrasonics Symposium
Number of pages4
StatePublished - 1993
EventProceedings of the IEEE 1993 Ultrasonics Symposium. Part 1 (of 2) - Baltimore, MD, USA
Duration: Oct 31 1993Nov 3 1993

Publication series

NameProceedings of the IEEE Ultrasonics Symposium
ISSN (Print)1051-0117


ConferenceProceedings of the IEEE 1993 Ultrasonics Symposium. Part 1 (of 2)
CityBaltimore, MD, USA

ASJC Scopus subject areas

  • Acoustics and Ultrasonics


Dive into the research topics of 'Time-resolved acoustic microscopy of short cracks'. Together they form a unique fingerprint.

Cite this