Void profiles in unidirectional solidification: The role of capillary forces and gravity

C. D. Sulfredge, K. A. Tagavi, L. C. Chow

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Some of the effects of capillary forces and the solid-liquid contact angle have been incorporated into previously known solutions for solidification shrinkage void profiles. Comparisons are then drawn between the original profiles from the literature and the modified capillary result. Since the capillary rise is a function of the gravitational acceleration, the new solution could also be extended down to reduced gravity conditions. We feel these results will lead to a better understanding of solidification shrinkage void shapes in a variety of circumstances.

Original languageEnglish
Pages (from-to)608-615
Number of pages8
JournalJournal of Thermophysics and Heat Transfer
Volume8
Issue number3
DOIs
StatePublished - 1994

Bibliographical note

Publisher Copyright:
Copyright © 1993 by the American Institute of Aeronautics and Astronautics, Inc. All rights reserved.

ASJC Scopus subject areas

  • Condensed Matter Physics

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