TY - GEN
T1 - Wettability of a Cu-nanoparticle-reinforced solder matrix paste composite
AU - Chen, Maoai
AU - Zhao, Hui
AU - Liu, Wen
AU - Sekulic, Dusan P.
PY - 2012
Y1 - 2012
N2 - This paper summarizes a phenomenological preliminary study of nano-particle reinforced composite solder pastes' spreading over Cu substrates. The nano reinforcements included Cu and non-Cu particles. Solder matrix were lead and lead-free systems (including binder and flux). This report focuses in particular on Cu reinforced Sn-Pb materials and indicates some differences vs. lead-free systems. Wettability of the composite over Cu substrates was investigated using a realtime in-situ visualization of the triple line movement as well as the equilibrium contact angle measurements. It was established that the addition of Cu nanoparticles hampers spreading of the eutectic Sn-Pb solder paste and lowers the melting temperature of a nano- composite, but does not significantly change the spreading time, the final spread domain and the equilibrium contact angle, if the content of nano particles is less than 2.5 %. Further increase of nano - particles' content up to 5% indicates a decrease in the final spreading domain and increase in the equilibrium contact angle.
AB - This paper summarizes a phenomenological preliminary study of nano-particle reinforced composite solder pastes' spreading over Cu substrates. The nano reinforcements included Cu and non-Cu particles. Solder matrix were lead and lead-free systems (including binder and flux). This report focuses in particular on Cu reinforced Sn-Pb materials and indicates some differences vs. lead-free systems. Wettability of the composite over Cu substrates was investigated using a realtime in-situ visualization of the triple line movement as well as the equilibrium contact angle measurements. It was established that the addition of Cu nanoparticles hampers spreading of the eutectic Sn-Pb solder paste and lowers the melting temperature of a nano- composite, but does not significantly change the spreading time, the final spread domain and the equilibrium contact angle, if the content of nano particles is less than 2.5 %. Further increase of nano - particles' content up to 5% indicates a decrease in the final spreading domain and increase in the equilibrium contact angle.
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M3 - Conference contribution
AN - SCOPUS:84862151294
SN - 9781615039753
T3 - IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
SP - 475
EP - 479
BT - IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
T2 - 5th International Brazing and Soldering Conference, IBSC 2012
Y2 - 22 April 2012 through 25 April 2012
ER -