@inproceedings{a45231bad5724cb4af94b97afd80a516,
title = "Wetting kinetics of eutectic lead and lead-free solders: Spreading over Cu surface",
abstract = "Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using a real time in situ monitoring of the triple line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. A significantly different kinetics of lead vs. lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. SEM and EDX analysis of the re-solidified solder surface within a halo region is discussed.",
keywords = "Lead, Lead-free, Soldering, Wetting",
author = "Zhao Hui and Nalagatla, {Dinesh Reddy} and Sekulic, {Dusan P.}",
year = "2008",
language = "English",
isbn = "9780873397162",
series = "TMS Annual Meeting",
pages = "619--624",
booktitle = "TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings",
note = "TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties ; Conference date: 09-03-2008 Through 13-03-2008",
}