Wetting kinetics of eutectic lead and lead-free solders: Spreading over Cu surface

Zhao Hui, Dinesh Reddy Nalagatla, Dusan P. Sekulic

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using a real time in situ monitoring of the triple line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. A significantly different kinetics of lead vs. lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. SEM and EDX analysis of the re-solidified solder surface within a halo region is discussed.

Original languageEnglish
Title of host publicationTMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings
Subtitle of host publicationMaterials Processing and Properties
Pages619-624
Number of pages6
StatePublished - 2008
EventTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties - New Orleans, LA, United States
Duration: Mar 9 2008Mar 13 2008

Publication series

NameTMS Annual Meeting
Volume1

Conference

ConferenceTMS 2008 Annual Meeting Supplemental: Materials Processing and Properties
Country/TerritoryUnited States
CityNew Orleans, LA
Period3/9/083/13/08

Keywords

  • Lead
  • Lead-free
  • Soldering
  • Wetting

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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