Abstract
Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.
Original language | English |
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Pages (from-to) | 284-291 |
Number of pages | 8 |
Journal | Journal of Electronic Materials |
Volume | 38 |
Issue number | 2 |
DOIs | |
State | Published - Feb 2009 |
Bibliographical note
Funding Information:The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.
Keywords
- Lead-free and lead solders
- Soldering
- Wetting
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Materials Chemistry
- Electrical and Electronic Engineering