Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao; Dinesh Reddy Nalagatla; Dusan P. Sekulic

doi:10.1007/s11664-008-0590-5

Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao, Dinesh Reddy Nalagatla, Dusan P. Sekulic

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

Original language	English
Pages (from-to)	284-291
Number of pages	8
Journal	Journal of Electronic Materials
Volume	38
Issue number	2
DOIs	https://doi.org/10.1007/s11664-008-0590-5
State	Published - Feb 2009

Bibliographical note

Funding Information:
The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

Keywords

Lead-free and lead solders
Soldering
Wetting

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-008-0590-5

Cite this

@article{3245063429854386a8064ca76fd60f65,

title = "Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface",

abstract = "Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.",

keywords = "Lead-free and lead solders, Soldering, Wetting",

author = "Hui Zhao and Nalagatla, {Dinesh Reddy} and Sekulic, {Dusan P.}",

note = "Funding Information: The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.",

year = "2009",

month = feb,

doi = "10.1007/s11664-008-0590-5",

language = "English",

volume = "38",

pages = "284--291",

number = "2",

}

TY - JOUR

T1 - Wetting kinetics of eutectic lead and lead-free solders

T2 - Spreading over the Cu surface

AU - Zhao, Hui

AU - Nalagatla, Dinesh Reddy

AU - Sekulic, Dusan P.

N1 - Funding Information: The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

PY - 2009/2

Y1 - 2009/2

N2 - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

AB - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

KW - Lead-free and lead solders

KW - Soldering

KW - Wetting

UR - http://www.scopus.com/inward/record.url?scp=58349096456&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=58349096456&partnerID=8YFLogxK

U2 - 10.1007/s11664-008-0590-5

DO - 10.1007/s11664-008-0590-5

M3 - Article

AN - SCOPUS:58349096456

VL - 38

SP - 284

EP - 291

IS - 2

ER -

Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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