Abstract
Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 284-291 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 38 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2009 |
Bibliographical note
Funding Information:The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.
Funding
The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.
| Funders | Funder number |
|---|---|
| UK Center for Manufacturing | |
| Kentucky Science and Engineering Foundation | KSEF-829-RDE-007, KSEF-07-RDE-010 |
Keywords
- Lead-free and lead solders
- Soldering
- Wetting
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Materials Chemistry
- Electrical and Electronic Engineering