Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao; Dinesh Reddy Nalagatla; Dusan P. Sekulic

doi:10.1007/s11664-008-0590-5

Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao, Dinesh Reddy Nalagatla, Dusan P. Sekulic

Research output: Contribution to journal › Article › peer-review

26 Scopus citations

Abstract

Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

Original language	English
Pages (from-to)	284-291
Number of pages	8
Journal	Journal of Electronic Materials
Volume	38
Issue number	2
DOIs	https://doi.org/10.1007/s11664-008-0590-5
State	Published - Feb 2009

Bibliographical note

Funding Information:
The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

Keywords

Lead-free and lead solders
Soldering
Wetting

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-008-0590-5

Cite this

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title = "Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface",

abstract = "Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.",

keywords = "Lead-free and lead solders, Soldering, Wetting",

author = "Hui Zhao and Nalagatla, {Dinesh Reddy} and Sekulic, {Dusan P.}",

note = "Funding Information: The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.",

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language = "English",

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T2 - Spreading over the Cu surface

AU - Zhao, Hui

AU - Nalagatla, Dinesh Reddy

AU - Sekulic, Dusan P.

N1 - Funding Information: The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

PY - 2009/2

Y1 - 2009/2

N2 - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

AB - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

KW - Lead-free and lead solders

KW - Soldering

KW - Wetting

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Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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