Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders

Maoai Chen, Yuanning Jiang, D. P. Sekulic, Hui Zhao

Research output: Contribution to journalArticlepeer-review


SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner's law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.

Original languageEnglish
Pages (from-to)16-20
Number of pages5
JournalChina Welding (English Edition)
Issue number3
StatePublished - Sep 2010


  • Composite solder
  • Nanoparticle
  • Spreadability
  • Wetting kinetics

ASJC Scopus subject areas

  • Mechanics of Materials
  • Industrial and Manufacturing Engineering


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