Abstract
SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner's law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.
| Original language | English |
|---|---|
| Pages (from-to) | 16-20 |
| Number of pages | 5 |
| Journal | China Welding (English Edition) |
| Volume | 19 |
| Issue number | 3 |
| State | Published - Sep 2010 |
Keywords
- Composite solder
- Nanoparticle
- Spreadability
- Wetting kinetics
ASJC Scopus subject areas
- Mechanics of Materials
- Industrial and Manufacturing Engineering