A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates

Hongqin Wang; Hui Zhao; Dusan P. Sekulic; Yiyu Qian

doi:10.1007/s11664-008-0502-8

A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu ₆Sn ₅/Cu ₃Sn)/Cu substrates

Hongqin Wang, Hui Zhao, Dusan P. Sekulic, Yiyu Qian

Producción científica: Article › revisión exhaustiva

26 Citas (Scopus)

Resumen

Reactive wetting of solders on Cu and Cu ₆Sn ₅/Cu ₃Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu ₆Sn ₅/Cu ₃Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu ₆Sn ₅/Cu ₃Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu ₆Sn ₅/Cu ₃Sn/Cu substrates.

Idioma original	English
Páginas (desde-hasta)	1640-1647
Número de páginas	8
Publicación	Journal of Electronic Materials
Volumen	37
N.º	10
DOI	https://doi.org/10.1007/s11664-008-0502-8
Estado	Published - oct 2008

Nota bibliográfica

Funding Information:
This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.

Financiación

This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.

Financiadores	Número del financiador
University of Kentucky Center for Manufacturing
Kentucky Science and Engineering Foundation	KSEF-1490-RDE-010, KSEF-829-RDE-007

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-008-0502-8

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title = "A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates",

abstract = "Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.",

keywords = "Bonding, Intermetallics, Lead-free solders, Wetting",

author = "Hongqin Wang and Hui Zhao and Sekulic, \{Dusan P.\} and Yiyu Qian",

note = "Funding Information: This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.",

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AU - Zhao, Hui

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AU - Qian, Yiyu

N1 - Funding Information: This work has been funded through a grant from Kentucky Science and Engineering Foundation (Grant Nos. KSEF-829-RDE-007 and KSEF-1490-RDE-010). One of the authors (H. Wang) acknowledges the visiting scholarship support from the University of Kentucky Center for Manufacturing.

PY - 2008/10

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N2 - Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.

AB - Reactive wetting of solders on Cu and Cu 6Sn 5/Cu 3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu 6Sn 5/Cu 3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu 6Sn 5/Cu 3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu 6Sn 5/Cu 3Sn/Cu substrates.

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