TY - GEN
T1 - A semi-analytical method to predict printed circuit board package temperatures
AU - Funk, John N.
AU - Menguc, M. Pinar
AU - Tagavi, Kaveh A.
AU - Cremers, Clifford J.
PY - 1991/2
Y1 - 1991/2
N2 - A fast, easy-to-use method is developed to predict steady state temperatures on printed circuit boards subjected to heating by a single heat source or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The method is verified by comparison with detailed finite element techniques. The agreement between the temperature distributions predicted by the two methods is very good.
AB - A fast, easy-to-use method is developed to predict steady state temperatures on printed circuit boards subjected to heating by a single heat source or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The method is verified by comparison with detailed finite element techniques. The agreement between the temperature distributions predicted by the two methods is very good.
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M3 - Conference contribution
AN - SCOPUS:0026105159
SN - 0879426640
T3 - Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium
SP - 7
EP - 14
BT - Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium
T2 - Proceedings of Seventh 1991 Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Y2 - 12 February 1991 through 14 February 1991
ER -