Resumen
Building electronic circuits is one of the most common hands-on activities in learning STEM subjects. Beginning students often find it difficult to translate a circuit schematic into the construction of the physical circuit on a breadboard. In this paper, we describe an Augmented Reality circuit learning software that can provide students with step-by-step instructions by placing virtual circuit components on a physical breadboard. We propose a novel image processing pipeline that can robustly identify the planar structure of a breadboard, even in the presence of occluding circuit components on the breadboard. Using a commercially available library of 3D circuit component models, the estimated 3D structure of the breadboard allows us to render arbitrary circuit components on it in real time. Experimental results demonstrate that our algorithms are accurate and can produce realistic-looking virtual circuits.
| Idioma original | English |
|---|---|
| Título de la publicación alojada | 2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings |
| ISBN (versión digital) | 9781728192017 |
| DOI | |
| Estado | Published - 2021 |
| Evento | 53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Daegu, Korea, Republic of Duración: may 22 2021 → may 28 2021 |
Serie de la publicación
| Nombre | Proceedings - IEEE International Symposium on Circuits and Systems |
|---|---|
| Volumen | 2021-May |
| ISSN (versión impresa) | 0271-4310 |
Conference
| Conference | 53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 |
|---|---|
| País/Territorio | Korea, Republic of |
| Ciudad | Daegu |
| Período | 5/22/21 → 5/28/21 |
Nota bibliográfica
Publisher Copyright:© 2021 IEEE
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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