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Augmented reality circuit learning

Producción científica: Conference contributionrevisión exhaustiva

4 Citas (Scopus)

Resumen

Building electronic circuits is one of the most common hands-on activities in learning STEM subjects. Beginning students often find it difficult to translate a circuit schematic into the construction of the physical circuit on a breadboard. In this paper, we describe an Augmented Reality circuit learning software that can provide students with step-by-step instructions by placing virtual circuit components on a physical breadboard. We propose a novel image processing pipeline that can robustly identify the planar structure of a breadboard, even in the presence of occluding circuit components on the breadboard. Using a commercially available library of 3D circuit component models, the estimated 3D structure of the breadboard allows us to render arbitrary circuit components on it in real time. Experimental results demonstrate that our algorithms are accurate and can produce realistic-looking virtual circuits.

Idioma originalEnglish
Título de la publicación alojada2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings
ISBN (versión digital)9781728192017
DOI
EstadoPublished - 2021
Evento53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Daegu, Korea, Republic of
Duración: may 22 2021may 28 2021

Serie de la publicación

NombreProceedings - IEEE International Symposium on Circuits and Systems
Volumen2021-May
ISSN (versión impresa)0271-4310

Conference

Conference53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021
País/TerritorioKorea, Republic of
CiudadDaegu
Período5/22/215/28/21

Nota bibliográfica

Publisher Copyright:
© 2021 IEEE

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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