Deformation behavior of tin and some tin alloys

Fuqian Yang; J. C.M. Li

doi:10.1007/978-0-387-48433-4_12

Deformation behavior of tin and some tin alloys

Fuqian Yang
, J. C.M. Li

Producción científica: Chapter › revisión exhaustiva

6 Citas (Scopus)

Resumen

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Idioma original	English
Título de la publicación alojada	Lead-Free Electronic Solders
Subtítulo de la publicación alojada	A Special Issue of the Journal of Materials Science: Materials in Electronics
Páginas	191-210
Número de páginas	20
DOI	https://doi.org/10.1007/978-0-387-48433-4_12
Estado	Published - 2007

ASJC Scopus subject areas

General Engineering

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10.1007/978-0-387-48433-4_12

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Deformation behavior of tin and some tin alloys

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