Deformation behavior of tin and some tin alloys

Fuqian Yang; J. C.M. Li

doi:10.1007/s10854-006-9016-4

Deformation behavior of tin and some tin alloys

Fuqian Yang
, J. C.M. Li

Producción científica: Article › revisión exhaustiva

80 Citas (Scopus)

Resumen

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

Idioma original	English
Páginas (desde-hasta)	191-210
Número de páginas	20
Publicación	Journal of Materials Science: Materials in Electronics
Volumen	18
N.º	1-3
DOI	https://doi.org/10.1007/s10854-006-9016-4
Estado	Published - mar 2007

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1007/s10854-006-9016-4

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@article{8003b1f50dd94d3d939fe41da2972b9b,

title = "Deformation behavior of tin and some tin alloys",

abstract = "Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.",

author = "Fuqian Yang and Li, \{J. C.M.\}",

year = "2007",

month = mar,

doi = "10.1007/s10854-006-9016-4",

language = "English",

volume = "18",

pages = "191--210",

number = "1-3",

}

TY - JOUR

T1 - Deformation behavior of tin and some tin alloys

AU - Yang, Fuqian

AU - Li, J. C.M.

PY - 2007/3

Y1 - 2007/3

N2 - Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

AB - Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

UR - https://www.scopus.com/pages/publications/33845700624

UR - https://www.scopus.com/pages/publications/33845700624#tab=citedBy

U2 - 10.1007/s10854-006-9016-4

DO - 10.1007/s10854-006-9016-4

M3 - Article

AN - SCOPUS:33845700624

SN - 0957-4522

VL - 18

SP - 191

EP - 210

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 1-3

ER -

Deformation behavior of tin and some tin alloys

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ASJC Scopus subject areas

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