Resumen
An analysis was made of the diffusional creep in polycrystalline materials when subjected to simultaneous action of tensile stress and electric current. Incorporating the contribution of electromigration to atomic diffusion in grain boundaries, the problem of grain boundary diffusion was solved. A simple relationship was derived between diffusional creep rate and local electric field intensity (current density). The results showed that electromigration can enhance the diffusional creep in polycrystalline materials.
| Idioma original | English |
|---|---|
| Páginas (desde-hasta) | 165-171 |
| Número de páginas | 7 |
| Publicación | International Journal of Applied Electromagnetics and Mechanics |
| Volumen | 40 |
| N.º | 2 |
| DOI | |
| Estado | Published - 2012 |
Financiación
| Financiadores | Número del financiador |
|---|---|
| National Science Foundation Arctic Social Science Program | 0959896 |
| National Science Foundation Arctic Social Science Program |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering
Huella
Profundice en los temas de investigación de 'Effect of electromigration on diffusional creep in polycrystalline materials'. En conjunto forman una huella única.Citar esto
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