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Effects of annealing on microstructure of osmium-ruthenium thin films

Producción científica: Conference contribution › revisión exhaustiva

5 Citas (Scopus)

Resumen

Osmium-ruthenium (OsRu) thin films of different thickness were deposited on porous tungsten (W) pellets in a configuration similar to dispenser cathodes, using two separate sputtering systems. In order to assess which films may best inhibit interdiffusion between the OsRu film and the W substrate during annealing, the grain structure and texture of OsRu films were characterized by x-ray diffraction and scanning electron microscopy.

Idioma originalEnglish
Título de la publicación alojada2009 IEEE International Vacuum Electronics Conference, IVEC 2009
Páginas177-178
Número de páginas2
DOI
EstadoPublished - 2009
Evento2009 IEEE International Vacuum Electronics Conference, IVEC 2009 - Rome, Italy
Duración: abr 28 2009 → abr 30 2009

Serie de la publicación

Nombre2009 IEEE International Vacuum Electronics Conference, IVEC 2009

Conference

Conference2009 IEEE International Vacuum Electronics Conference, IVEC 2009
País/TerritorioItaly
CiudadRome
Período4/28/09 → 4/30/09

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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