TY - GEN
T1 - Electrical and mechanical properties of carbon nanotube filled adhesives on lead free PCB surface finishes
AU - Mantena, Keerthivarma
AU - Lumpp, Janet K.
AU - Velicheti, Naveen
AU - Jasti, Midhun
AU - Sirigiri, Poojitha
PY - 2008
Y1 - 2008
N2 - Electrically conductive adhesives are attractive alternatives to solder and die attach materials in electronic assemblies particularly in the lead free era. Compared to metal filled conductive adhesives, multiwall carbon nanotube (MWCNT) filled adhesives are lightweight, corrosion resistant, high strength and resistant to metal migration. Previous studies of MWCNT filled epoxies on bare copper printed circuit boards identified contact resistance as a challenge for surface mount component attachment. The adhesive formulations under investigation are mixtures of epoxy Epon resin 862, Heloxy modifier 68, anhydride curing agent, catalyst and MWCNT. Loadings ranging from 2 to 14 wt% are tested to determine electrical and mechanical properties. Here we present contact resistance, volume resistivity and lap shear testing of MWCNT filled epoxy on printed circuit boards with various surface finishes on the copper pads. The surface finishes selected are immersion tin, immersion silver and electroless nickel immersion gold (ENIG).
AB - Electrically conductive adhesives are attractive alternatives to solder and die attach materials in electronic assemblies particularly in the lead free era. Compared to metal filled conductive adhesives, multiwall carbon nanotube (MWCNT) filled adhesives are lightweight, corrosion resistant, high strength and resistant to metal migration. Previous studies of MWCNT filled epoxies on bare copper printed circuit boards identified contact resistance as a challenge for surface mount component attachment. The adhesive formulations under investigation are mixtures of epoxy Epon resin 862, Heloxy modifier 68, anhydride curing agent, catalyst and MWCNT. Loadings ranging from 2 to 14 wt% are tested to determine electrical and mechanical properties. Here we present contact resistance, volume resistivity and lap shear testing of MWCNT filled epoxy on printed circuit boards with various surface finishes on the copper pads. The surface finishes selected are immersion tin, immersion silver and electroless nickel immersion gold (ENIG).
UR - https://www.scopus.com/pages/publications/84876939808
UR - https://www.scopus.com/pages/publications/84876939808#tab=citedBy
M3 - Conference contribution
AN - SCOPUS:84876939808
SN - 0930815866
SN - 9780930815868
T3 - Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008
SP - 1075
EP - 1081
BT - Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008
T2 - 41st Annual International Symposium on Microelectronics, IMAPS 2008
Y2 - 2 November 2008 through 6 November 2008
ER -