Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate

Xiang Gao; Dongyan Ding; Zhi Chen; Ming Li; Dali Mao

doi:10.1109/ICEPT.2007.4441492

Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate

Xiang Gao, Dongyan Ding, Zhi Chen, Ming Li, Dali Mao

Producción científica: Conference contribution › revisión exhaustiva

Resumen

A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.

Idioma original	English
Título de la publicación alojada	Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOI	https://doi.org/10.1109/ICEPT.2007.4441492
Estado	Published - 2007
Evento	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duración: ago 14 2007 → ago 17 2007

Serie de la publicación

Nombre	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2007 8th International Conference on Electronic Packaging Technology, ICEPT
País/Territorio	China
Ciudad	Shanghai
Período	8/14/07 → 8/17/07

ASJC Scopus subject areas

General Engineering

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10.1109/ICEPT.2007.4441492

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Gao, X., Ding, D., Chen, Z., Li, M., & Mao, D. (2007). Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate. En Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT Artículo 4441492 (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441492

@inproceedings{a4faa33b1bc34306a2214c16b9af5934,

title = "Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate",

abstract = "A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.",

author = "Xiang Gao and Dongyan Ding and Zhi Chen and Ming Li and Dali Mao",

year = "2007",

doi = "10.1109/ICEPT.2007.4441492",

language = "English",

isbn = "1424413923",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

booktitle = "Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

Gao, X, Ding, D, Chen, Z, Li, M & Mao, D 2007, Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate. En Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT., 4441492, Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 8/14/07. https://doi.org/10.1109/ICEPT.2007.4441492

Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate. / Gao, Xiang; Ding, Dongyan; Chen, Zhi et al.
Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441492 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Producción científica: Conference contribution › revisión exhaustiva

TY - GEN

T1 - Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate

AU - Gao, Xiang

AU - Ding, Dongyan

AU - Chen, Zhi

AU - Li, Ming

AU - Mao, Dali

PY - 2007

Y1 - 2007

N2 - A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.

AB - A transition layer of Ni-P coating will help enhance the hydrogen sensing stability of Pd films supported by silicon wafers. In this work, Pd films were electrodeposited on electroless Ni-P coated silicon wafers. The effect of deposition parameters on the microstructure (especially the morphology) of Ni-P coatings and Pd films were investigated. Experimental results indicated that a lower pH value of electroless plating solution and a longer electroless plating time could increase the size of Ni-P nodular particles. In addition, the morphology of Pd films was shaped by the nanostructures of the Ni-P coating. An optimized Pd /Ni-P structures is expected to present good hydrogen sensing performance.

UR - https://www.scopus.com/pages/publications/50249161877

UR - https://www.scopus.com/inward/citedby.url?scp=50249161877&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2007.4441492

DO - 10.1109/ICEPT.2007.4441492

M3 - Conference contribution

AN - SCOPUS:50249161877

SN - 1424413923

SN - 9781424413928

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT

T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT

Y2 - 14 August 2007 through 17 August 2007

ER -

Electrodeposition of palladium film on electroless Ni-P coatings supported by Si substrate

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