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Fracture-induced polymeric grating structures

  • C. C. Lin
  • , F. Yang
  • , J. W. Chin
  • , L. Sung
  • , S. Lee

Producción científica: Conference contributionrevisión exhaustiva

Resumen

Fracture-induced structuring (FIS) is found in the polymer thin film sandwiched between two relatively rigid flat plates by simply separating apart the plates, which produces a complementary set of micro/nano scale nonsymmetrical periodic polymer ripple gratings on both plates. FIS is a potential candidate to be a low-cost and high-throughput nanopatterning technique, however, the the cracking mechanism of FIS is still not fully understood. In this study, FIS gratings were observed to follow the direction of the maximum in-plane shear stress induced by external separating-load. Furthermore, the result of gamma-irradiation effect shows that homogeneous/glassy and brittle material properties of polymer thin film is essential to cause uniform and smooth cracking. More phenomena such as primary/secondary gratings and competed rupture are also discussed in this paper. The results of this study can be applied to nanopatterning and nanotechnology.

Idioma originalEnglish
Título de la publicación alojadaTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Páginas318-321
Número de páginas4
EstadoPublished - 2011
EventoNanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 - Boston, MA, United States
Duración: jun 13 2011jun 16 2011

Serie de la publicación

NombreTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Volumen2

Conference

ConferenceNanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
País/TerritorioUnited States
CiudadBoston, MA
Período6/13/116/16/11

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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