Resumen
The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.
| Idioma original | English |
|---|---|
| Título de la publicación alojada | Electronics Manufacturing Issues |
| Páginas | 3-8 |
| Número de páginas | 6 |
| ISBN (versión digital) | 9780791816530 |
| DOI | |
| Estado | Published - 1999 |
| Evento | ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 - Nashville, United States Duración: nov 14 1999 → nov 19 1999 |
Serie de la publicación
| Nombre | ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) |
|---|---|
| Volumen | 1999-K |
Conference
| Conference | ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 |
|---|---|
| País/Territorio | United States |
| Ciudad | Nashville |
| Período | 11/14/99 → 11/19/99 |
Nota bibliográfica
Publisher Copyright:© 1999 American Society of Mechanical Engineers (ASME). All rights reserved.
Financiación
The research is partly supported by the NSF Grant number DMI-9634889,
| Financiadores | Número del financiador |
|---|---|
| National Science Foundation (NSF) | DMI-9634889 |
ASJC Scopus subject areas
- Mechanical Engineering
Huella
Profundice en los temas de investigación de 'Interaction Between Wire and Ingot in Wiresaw Slicing'. En conjunto forman una huella única.Citar esto
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