Interior stress for axisymmetric abrasive indentation in the free abrasive machining process: Slicing silicon wafers with modern wiresaw

Engineering

• Axisymmetric 100%
• Indentation 100%
• Free Abrasive Machining 100%
• Silicon Wafer 100%
• Hydrodynamics 33%
• Maximum Shear Stress 33%
• Abrasive 33%
• Initiation of Crack 16%
• Closed Form Solution 16%
• Elastic Half 16%
• Contact Point 16%
• Manufacturing Process 16%
• Localised Effect 16%
• Contact Zone 16%
• Harmonics 16%
• Flat Surface 16%
• Pressure Distribution 16%
• Abrasive Slurry 16%

Material Science

• Silicon Wafer 100%
• Indentation 100%
• Machining 100%
• Surface (Surface Science) 66%
• Hydrodynamics 33%
• Abrasive 33%
• Nucleation 16%
• Crack Initiation 16%