Resumen
Thermal Protection System (TPS) materials in hypersonic flight not only endure extreme aerothermal loads but are also subject to harsh atmospheric conditions where particulates of sand, ice, or volcanic ash can cause spallation damage and erosion. In this study, a laser induced particle impact testing (LIPIT) method is used to investigate the high-speed impact of microparticles on a range of TPS materials. Monodisperse alumina microspheres with nominal diameters of 60 μm are accelerated to velocities of up to 520 m/s and are impacted on ultra-fine grain graphite, 2D woven reinforced carbon-carbon (RCC), and sintered silicon carbide (SiC) targets. The cratering and spallation mechanisms and their extent for graphite and RCC are studied in situ via high-speed imaging and postmortem using scanning electron microscopy (SEM) and digital confocal microscopy. For silicon carbide experiments, no discernible surface damage was observed and the alumina projectiles were found to fragment upon impact.
| Idioma original | English |
|---|---|
| Título de la publicación alojada | AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2025 |
| DOI | |
| Estado | Published - 2025 |
| Evento | AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2025 - Orlando, United States Duración: ene 6 2025 → ene 10 2025 |
Serie de la publicación
| Nombre | AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2025 |
|---|
Conference
| Conference | AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2025 |
|---|---|
| País/Territorio | United States |
| Ciudad | Orlando |
| Período | 1/6/25 → 1/10/25 |
Nota bibliográfica
Publisher Copyright:© 2025, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.
ASJC Scopus subject areas
- Aerospace Engineering
Huella
Profundice en los temas de investigación de 'Laser-driven Microparticle Impact Experiments on Reinforced Carbon-Carbon, Graphite, and Silicon Carbide'. En conjunto forman una huella única.Citar esto
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