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Molecular mechanism of base excision repair of uracil-containing DNA in yeast cell-free extracts

  • Zhigang Wang
  • , Xiaohua Wu
  • , Errol C. Friedberg

Producción científica: Articlerevisión exhaustiva

31 Citas (Scopus)

Resumen

Base excision repair (BER) constitutes a ubiquitous excision repair mechanism, which is responsible for the removal of multiple types of damaged and inappropriate bases in DNA. We have employed a yeast cell-free system to examine the biochemical mechanism of the BER pathway in lower eukaryotes. Using uracil-containing DNA as a model substrate, we demonstrate that yeast BER requires Apn1 protein, an Escherichia coli endonuclease IV homolog. In extracts of an apn1 deletion mutant, the 5'-incision at AP (apurinic/apyrimidinic) sites is not detectable, supporting the notion that yeast contains only one major 5'-AP endonuclease. The processing of the 5'- deoxyribose phosphate moieties was found to be a rate-limiting step. During BER of uracil-containing DNA, repair patch sizes of 1-5 nucleotides were detected, with single nucleotide repair patches predominant.

Idioma originalEnglish
Páginas (desde-hasta)24064-24071
Número de páginas8
PublicaciónJournal of Biological Chemistry
Volumen272
N.º38
DOI
EstadoPublished - sept 19 1997

Financiación

FinanciadoresNúmero del financiador
National Childhood Cancer Registry – National Cancer InstituteR01CA067978

    ASJC Scopus subject areas

    • Biochemistry
    • Molecular Biology
    • Cell Biology

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