Resumen
Voids (a land of flaw) are not desired in the products of many industrial and manufacturing processes. In this article, we seek effective ways to remove the void by modeling the void migration and predicting the intermediate and the final shape of the cavity. The boundary element method (BEM) is applied to the quasi-steady state void migration process governed by Laplace’s equation. The conduction solution depends on the void shape, and the void shape depends on the conduction solution. Hence this is a conjugate problem. The analytical formulation and the numerical approach are outlined. The Overhauser spline elements are used in the BEM to ensure continuous first-order derivatives on the void boundary. Given the material properties, geometry of the physical model, and boundary conditions, this computer model can predict detailed information such as flux, velocity and direction of void motion, and temperature at any stage of the void migration. Different strategies for void removal are investigated.
| Idioma original | English |
|---|---|
| Páginas (desde-hasta) | 365-378 |
| Número de páginas | 14 |
| Publicación | Numerical Heat Transfer; Part A: Applications |
| Volumen | 30 |
| N.º | 4 |
| DOI | |
| Estado | Published - sept 1996 |
Nota bibliográfica
Funding Information:Received 28 November 1995; accepted 15 March 1996. This project was supported in part by a NASA/EPSCoR grant, no. WKU522761-94-01. Address correspondence to Professor Kaveh A. Tagavi, Department of Mechanical Engineering, University of Kentucky, Lexington, KY 40506, USA.
Financiación
Received 28 November 1995; accepted 15 March 1996. This project was supported in part by a NASA/EPSCoR grant, no. WKU522761-94-01. Address correspondence to Professor Kaveh A. Tagavi, Department of Mechanical Engineering, University of Kentucky, Lexington, KY 40506, USA.
| Financiadores |
|---|
| Kentucky NASA EPSCoR |
ASJC Scopus subject areas
- Numerical Analysis
- Condensed Matter Physics
Huella
Profundice en los temas de investigación de 'Numerical modeling of void migration in solids due to temperature gradient using the boundary element method'. En conjunto forman una huella única.Citar esto
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