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Post-Layout Simulation of Quasi-Adiabatic Logic Based Physical Unclonable Function

  • Yasuhiro Takahashi
  • , Hiroki Koyasu
  • , S. Dinesh Kumar
  • , Himanshu Thapliyal

Producción científica: Conference contributionrevisión exhaustiva

5 Citas (Scopus)

Resumen

Silicon based Physical Unclonable Function (PUF) is a popular hardware security primitive for mitigating security vulnerabilities. Recently, Quasi-adiabatic logic based physical unclonable function (QUALPUF) was first proposed by Kumar and Thapliyal. QUALPUF has ultra low-power dissipation; hence it is suitable to implement in low-power portable electronic devices such RFIDs, wireless sensor nodes, etc. In this paper, we present the post-layout simulation results of the 4-bit QUALPUF for low-power portable electronic devices. To evaluate the uniqueness and reliability, the 4-bit QUALPUF is implemented in 0.18 um standard CMOS process with 1.8 V supply voltage. The QUALPUF occupies 58.7x15.7 um2 of layout area. The post-layout simulation results illustrate that the 4-bit QUALPUF has good uniqueness and reliability with 29.73 fJ/cycle/bit energy consumption.

Idioma originalEnglish
Título de la publicación alojadaProceedings - 2019 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2019
Páginas443-446
Número de páginas4
ISBN (versión digital)9781538670996
DOI
EstadoPublished - jul 2019
Evento18th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2019 - Miami, United States
Duración: jul 15 2019jul 17 2019

Serie de la publicación

NombreProceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI
Volumen2019-July
ISSN (versión impresa)2159-3469
ISSN (versión digital)2159-3477

Conference

Conference18th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2019
País/TerritorioUnited States
CiudadMiami
Período7/15/197/17/19

Nota bibliográfica

Publisher Copyright:
© 2019 IEEE.

Financiación

This work was supported by VLSI Design and Educational Center (VDEC), the University of Tokyo in collaboration with Cadence Corporation and Synopsys, Inc. The VLSI chip in this study has been fabricated in the chip fabrication program of VDEC, the University of Tokyo in collaboration with ROHM Corporation and Toppan Printing Corporation.

Financiadores
University of Tokyo

    ODS de las Naciones Unidas

    Este resultado contribuye a los siguientes Objetivos de Desarrollo Sostenible

    1. Affordable and clean energy
      Affordable and clean energy

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Control and Systems Engineering
    • Electrical and Electronic Engineering

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