System integration and packaging

Wen Ko; Peng Wang; Shem Lachhman

doi:10.1016/B978-0-323-26208-8.00006-6

System integration and packaging

Wen Ko
, Peng Wang
, Shem Lachhman

Producción científica: Chapter › revisión exhaustiva

2 Citas (Scopus)

Resumen

The human body is a harsh environment; bodily fluids are highly conductive and contain many chemical and biochemical species that are potentially harmful to implanted electronics and MEMS devices and components. At the same time, the body is a complex delicate living system that may be harmed by the material, shape, and size of the implant devices. The package is the outmost part of the implant that interfaces with the body; it has to protect the device from bodily fluids while protecting the body from any harmful effects of the packaged implant device.

Idioma original	English
Título de la publicación alojada	Implantable Biomedical Microsystems
Subtítulo de la publicación alojada	Design Principles and Applications
Páginas	113-136
Número de páginas	24
ISBN (versión digital)	9780323261906
DOI	https://doi.org/10.1016/B978-0-323-26208-8.00006-6
Estado	Published - ene 27 2015

Nota bibliográfica

Publisher Copyright:
© 2015 Elsevier Inc. All rights reserved..

Financiación

The kind guidance and work on pathological evaluation of tissue samples of Professor James Anderson of the Medical School, CWRU, is deeply appreciated. The technical help from the MEMS/NEMS group of EECS Department, CWRU, and APT Center, VA medical Center of Cleveland, and the technical guidance and editorial help of Professor Christian A. Zorman of EECS Department, CWR University, are gratefully acknowledged. The project described was supported by Award Number 1I01RX000443-01A2 from the Rehabilitation Research & Development Service of the VA Office of Research and Development, Case Western Reserve University, and the Cleveland Clinic.

Financiadores
Rehabilitation Research & Development Service of the VA Office of Research and Development
Cleveland Clinic
Case Western Reserve University

ASJC Scopus subject areas

General Medicine
General Health Professions

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System integration and packaging

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