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The impact of chemical mechanical planarization polishing on a surface textured with deterministic microasperities

Producción científica: Conference contributionrevisión exhaustiva

Resumen

In this paper a method for fabricating deterministic microasperities on stainless steel by a photolithographic lift-off technique followed by electrodeposition of nickel is presented. Triangular asperities with an asperity area fraction of 0.20 are deposited onto a stainless steel disk. Chemical mechanical planarization (CMP) polishing is employed for adjusting the heights of the asperities. The surface profiles of the asperities are then characterized. Results show that the surfaces of the as-deposited asperities have a curved profile with one side shorter than the other. The surface profile becomes more uniform after polishing in the CMP machine but polishing tends to round the edges and comers of the asperities. Additionally, polishing results in the grooving of channel in the substrate in between the asperities and chips the asperity walls.

Idioma originalEnglish
Título de la publicación alojadaProceedings of the World Tribology Congress III - 2005
Páginas523-524
Número de páginas2
DOI
EstadoPublished - 2005
Evento2005 World Tribology Congress III - Washington, D.C., United States
Duración: sept 12 2005sept 16 2005

Serie de la publicación

NombreProceedings of the World Tribology Congress III - 2005

Conference

Conference2005 World Tribology Congress III
País/TerritorioUnited States
CiudadWashington, D.C.
Período9/12/059/16/05

ASJC Scopus subject areas

  • General Engineering

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