TY - GEN
T1 - Time-resolved acoustic microscopy of short cracks
AU - Knauss, D.
AU - Briggs, G. A.D.
AU - Zhai, T.
AU - Martin, J. W.
PY - 1993
Y1 - 1993
N2 - Time-resolved acoustic microscopy has been used to measure the 3-dimensional profile of short cracks (70-200 μm surface length). In order to establish this technique the depth of short cracks in transparent materials were determined. This allows a comparison between the acoustic and direct optical measurements. Subsequently the depth of cracks and the growth of short fatigue cracks in Al-alloy were measured.
AB - Time-resolved acoustic microscopy has been used to measure the 3-dimensional profile of short cracks (70-200 μm surface length). In order to establish this technique the depth of short cracks in transparent materials were determined. This allows a comparison between the acoustic and direct optical measurements. Subsequently the depth of cracks and the growth of short fatigue cracks in Al-alloy were measured.
UR - https://www.scopus.com/pages/publications/0027721313
UR - https://www.scopus.com/pages/publications/0027721313#tab=citedBy
U2 - 10.1109/ultsym.1993.339540
DO - 10.1109/ultsym.1993.339540
M3 - Conference contribution
AN - SCOPUS:0027721313
SN - 0780312783
SN - 9780780312784
T3 - Proceedings of the IEEE Ultrasonics Symposium
SP - 599
EP - 602
BT - Proceedings of the IEEE Ultrasonics Symposium
T2 - Proceedings of the IEEE 1993 Ultrasonics Symposium. Part 1 (of 2)
Y2 - 31 October 1993 through 3 November 1993
ER -