Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao; Dinesh Reddy Nalagatla; Dusan P. Sekulic

doi:10.1007/s11664-008-0590-5

Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Hui Zhao, Dinesh Reddy Nalagatla, Dusan P. Sekulic

Producción científica: Article › revisión exhaustiva

28 Citas (Scopus)

Resumen

Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

Idioma original	English
Páginas (desde-hasta)	284-291
Número de páginas	8
Publicación	Journal of Electronic Materials
Volumen	38
N.º	2
DOI	https://doi.org/10.1007/s11664-008-0590-5
Estado	Published - feb 2009

Nota bibliográfica

Funding Information:
The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

Financiación

The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

Financiadores	Número del financiador
UK Center for Manufacturing
Kentucky Science and Engineering Foundation	KSEF-829-RDE-007, KSEF-07-RDE-010

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-008-0590-5

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title = "Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface",

abstract = "Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.",

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author = "Hui Zhao and Nalagatla, \{Dinesh Reddy\} and Sekulic, \{Dusan P.\}",

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T2 - Spreading over the Cu surface

AU - Zhao, Hui

AU - Nalagatla, Dinesh Reddy

AU - Sekulic, Dusan P.

N1 - Funding Information: The authors acknowledge the support of the Kentucky Science and Engineering Foundation through the Grants KSEF-07-RDE-010 and KSEF-829-RDE-007. One of the authors (D.R.N.) acknowledges the support of the UK Center for Manufacturing.

PY - 2009/2

Y1 - 2009/2

N2 - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

AB - Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

KW - Lead-free and lead solders

KW - Soldering

KW - Wetting

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Wetting kinetics of eutectic lead and lead-free solders: Spreading over the Cu surface

Resumen

Nota bibliográfica

Financiación

ASJC Scopus subject areas

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Huella

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